Electronics Forum | Mon Apr 01 10:24:29 EDT 2013 | emeto
First check the profile. I would go with linear profile and smoother increase of temperature. Usually you will get tombstones when you have too aggressive profile. My next step will be to redesign the stencil.
Electronics Forum | Wed Mar 21 13:47:16 EDT 2012 | jax
To have an Operating Temp (Tool Classification) within your range, you might want to try. PB85 (Pb85/Sb10/Sn5) SMT is normally processed using Vapor Phase but can also be achieved with Nitrogen assisted Convection Reflow depending on size and compl
Electronics Forum | Fri Mar 22 18:16:44 EDT 2013 | vpham
We are trying to use this high-temp solder paste due to a very special process, but we run into tombstones on chip caps, 0402 and 0603. We don't have this problem if we use regular SAC305 solder paste. If you have experience with this type of solde
Electronics Forum | Mon Apr 01 17:20:45 EDT 2013 | davef
In thinking about troubleshooting tombstoning {TS} defects, seek balance: * Pads the same size * Same amount of paste on each pad * Component placed with the same amount of contact on each pad * Heating the same on each pad, no via connection to a gr
Electronics Forum | Mon Dec 28 08:51:45 EST 2009 | jax
What solder are you talking about and what reflow method are you using? High Melt Alloys: SN96 (Sn96/Ag4 or Sn96.5/Ag3.5) - Simliar to SAC305 although normally uses Rosin based flux that can required more extensive cleaning. Pb85 (Pb85/Sb10/Sn5) -
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