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Contact: Sandy Lin Email:email@example.com Skype:onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD Our services Packing & Delivery 1)100% full New! - Original Factory Seal ! 2)Warranty: 12 m
Technical Library | 2020-02-18 09:56:24.0
Glob Top, Dam and Fill & Flit Chip Underfill To protect PCBs from damaging outside influences, they are coated with a thin layer of casting resin or protective finish during the conformal coating process. In addition to sealing the entire circuit board, it is possible to pot only sections or individual components on the substrate. Different methods ranging from "glob top" to "dam and fill" and "flip chip underfill" have been developed for this purpose.
Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. The purpose
Essemtec is a worldwide leader in manufacturing of highly flexible Surface Mount Technology (SMT) production equipment - pick-and-place system, dispenser, printer, oven, storage system and software Solutions.