New SMT Equipment: scientifice and test and 5,000 (2)

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

Panasonic CM202 used smt PCB pick and place machine

New Equipment | Pick & Place

=1.0 ±50/Chip Cpk>=1.0 ±35/QFP Cpk>=1.0 ±50/Chip Cpk >=1.0 ±35/QFP Cpk >=1.0 Productive Highest Tact (CPH/sec) 25,000/0.144 19,000/0.189 7,200/0.5

Langke Automation Equipment(smdmachine.com)

Industry News: scientifice and test and 5,000 (17)

Sales and Result Improved: VOGT electronic on the Right Course

Industry News | 2003-05-29 08:30:31.0

Losses halved in the first half year � New organization of electronics group next on the agenda

SMTnet

IPC and ITI to Host Conference on Critical and Emerging Environmental Product Requirements

Industry News | 2019-05-05 19:06:43.0

IPC – Association Connecting Electronics Industries® and the Information Technology Industry Council (ITI) will host a conference series on “Critical and Emerging Environmental Product Requirements” in Boston, the Chicago area and San Jose on June 3, 5, and 7, respectively. The series will feature well-known United Kingdom (UK) regulators Carl Magness, product safety enforcement team leader, and Paul Tennant, product safety enforcement manager, both within the UK Office of Business, Energy and Industrial Strategy (BEIS), and Giuseppina Luvara, a policy officer within the European Commission’s Directorate General of Environment.

Association Connecting Electronics Industries (IPC)

Express Newsletter: scientifice and test and 5,000 (815)

Partner Websites: scientifice and test and 5,000 (85)

DFN 3 & 4-Pin Numbering and JEDEC MO-236C Standard - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic1368&OB=DESC.html

www.pcblibraries.com/pod Once we created an FPX file with every JEDEC component family and their dimensions. Then we downloaded 5,000 component manufacturer's datasheets and entered all those component dimensions

PCB Libraries, Inc.


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