New SMT Equipment: scientifice and test and 5

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

Panasonic CM202 used smt PCB pick and place machine

New Equipment | Pick & Place

=1.0 ±50/Chip Cpk>=1.0 ±35/QFP Cpk>=1.0 ±50/Chip Cpk >=1.0 ±35/QFP Cpk >=1.0 Productive Highest Tact (CPH/sec) 25,000/0.144 19,000/0.189 7,200/0.5

Langke Automation Equipment(smdmachine.com)

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Selective soldering solutions with Jade soldering machine

Real Time Process Control BREAKTHROUGH for Dispensing Industry.
Void free Reflow Soldering

World's Best Reflow Oven Customizable for Unique Applications
Voidless Reflow Soldering

High Resolution Fast Speed Industrial Cameras.


High Speed Precision In-Line SPI System - Mirtec MS-11


Find a wide selection of nozzles, solder materials, storage solutions and more at SALESCON