Electronics Forum | Mon Jun 20 04:21:04 EDT 2005 | alex
What is the ideal component edge to board scored edge clearance?
Electronics Forum | Mon Nov 08 11:01:12 EST 1999 | Brian Larson
We are leaving 12-18 thousands material when scoring. Several components are cracking during depanelization. The pizza cutter machines out there are either too expensive or too slow to solve our problem. I am looking for a magical solution. In case
Electronics Forum | Mon Jun 20 09:12:55 EDT 2005 | davef
There's no easy answer. It depends on: * Thickness and size of the PCB in the array. * Means of separation. * Type of component. SMT components are more sensitive to the forces that need to be applied to separate the PCB. * Type SMT device. Ceram
Electronics Forum | Tue Nov 09 16:52:30 EST 1999 | John Sims
Brian, We recently investigated a depaneling press that might suit your application. The labor savings over pizza cutting will probably make it justifiable for you. The company seems to be lesser known in the US, but is partnered with a Japanese c
Electronics Forum | Tue Nov 09 16:52:50 EST 1999 | John Sims
Brian, We recently investigated a depaneling press that might suit your application. The labor savings over pizza cutting will probably make it justifiable for you. The company seems to be lesser known in the US, but is partnered with a Japanese c
Electronics Forum | Tue Nov 16 10:53:25 EST 1999 | Scott Cook
Ok, help me out here guys and gals...... I have never understood the concept of scoring on mixed technology or SMT boards. It is quite obvious to me that the potential for SMT solder joint damage through the mechanical stresses of breakout are high.
Electronics Forum | Mon Nov 08 19:10:10 EST 1999 | Brian W.
Oh boy, does that bring back memories!!!!! You are most likely breaking components when the board is flexed during separation. Any components perpendicular to the score are candidates for mechanical stress. We overcame the problem by making our ow
Electronics Forum | Tue Nov 09 11:50:33 EST 1999 | Steve Owen Snr prod eng.
We have recently purchased equipment that would probably solve your problem. We are using 1.6mm pcb material 1/3 of which is left unscored. When the pcb is de-panelized there is no damage to any components and we have cut our break time in half.
Electronics Forum | Tue Nov 09 20:06:26 EST 1999 | Robert Culpepper
This may help you regarding the V-Groove or scored board designs. With respect to material left, I did some experiments and found that for our process .009 of material seemed to be ideal. There was minimal stress required to break the boards apart ye
Electronics Forum | Fri Nov 30 15:27:19 EST 2001 | Rex Gustafson
Where can I find pcb scoring guidelines for boards with different thicknesses, panel arrays, ....?
