Jetting Simplified Jetting pumps are excellent for dispensing small volumes of fluid at high rates of speed. The NCM5000 simplifies jetting to its basic elements - this means easy set up, cleaning, and maintenance for you. The drive system is design
Virtual Industries offerings of small parts tips allows a person to easily handle parts as small as 100 microns (0.004"). There are nine different tip sizes for handling a variety of part sizes. Small die can be picked up from the side, top or other
Electronics Forum | Wed Jul 12 11:26:12 EDT 2006 | flipit
Hi, I believe you have classic gold imbrittlement here. With 80 microinches of gold you are way over the limit. You can try to reflow longer time and at a higher temperature. The gold does not melt into the solder joint. The gold dissolves into
Electronics Forum | Wed Jun 29 16:25:51 EDT 2005 | mattkehoe
When discussing this with the customer he said that his vendor recommended a hard gold plating finish on the board due to the BGA. I said "hard gold"??? And he said yes, hard gold. Turns out the boards were plated with hard gold, not ENIG. Thank
DEK 03IX automatic solder paste printing machine features advanced up/down k-view vision system, independent control and adjustment of lighting, high-speed moving lens, accurate alignment of PCB PCB and net board. The DEK Horizon 03IX automatic solde
Model ：YCPII PCB size ：length 330 x width 250mm ~ length 50 x width 50mm *Includes automatic adjustment of PCB width Printing head group Double scraper head group (Selection of scraper material: metal or rubber) Printing speed: 2 ~ 200mm/
Industry News | 2017-09-07 17:45:03.0
ZESTRON is pleased to announce that Naveen Ravindran, M.S.Ch.E, Application Engineer will present “PCB Surface Finishes and the Cleaning Process - A Compatibility Study” at SMTA International 2017, in Rosemont, IL.
Industry News | 2008-07-30 23:24:03.0
COLORADO SPRINGS, CO � July 29, 2008 � Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, introduces the VSPT0803 small part tip.
37. 5322 466 12047 peel-off plate 16mm PLATE STEEL 5322 360 40471 BDA-16x25,KONGANE1 CYLINDER PISTON 5322 132 00032 /Nozzle Station Fibre 5322 130 10062 /Nozzle Station Fibre 5322 130 10069 /SENSOR Conveyor in/out 1-3 5322 380 10285 /Multi-came
Juki 750 101 smt nozzle Description: Brand:JUKI Color:plated gold Material:imported steel Nozzle model:101 102 103 104 105 106 Application:Juki 750 smt machine Customize:yes Nozzle advantage: 1.The nozzle main body adopts imported steel, i
Technical Library | 2019-06-04 10:19:46.0
Interconnection technology relies very heavily on the ability of the conductors on a printed wiring assembly to maintain reliable signal integrity. Harsh environmental factors can precipitate a loss of conductivity due to oxidation and corrosion. Connections are typically soldered or inserted using pressure fitted connectors to obtain enough surface contact to meet the electrical conductivity requirements. In pressure contacts, surface integrity is especially critical where the abrasive effects of retraction and insertion can wear off the metallic finish from the contact area. This can expose the underlying copper or nickel and lead to increased resistance at the contact points. These types of conductors are frequently found in card edge connectors where the terminations are plated with a layer of nickel and gold (frequently referred to as gold fingers). A hard gold is typically used containing very small amounts of nickel and cobalt to increase the wear resistance.
Technical Library | 2019-05-23 10:30:22.0
Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1.
http://www.gpd-global.com This high speed Simplified Jetting Pump consists only two wetted parts, very easy to setup and clean. Efficient. NCM5000 Jetting pump dispenses surface mount glue / adhesive with excellent result. Watch this video. More In
www.unisoft-cim.com/pcbplace.htm - The ProntoPLACE module from Unisoft is used by electronics manufacturers to generate the necessary programs for automatic PCB assembly machines in minutes. ProntoPLACE programs most popular surface mount (SMT) place
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Wed Apr 20 00:00:00 EDT 2022 - Wed Apr 20 00:00:00 EDT 2022 | ,
Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies
Events Calendar | Tue Feb 12 00:00:00 EST 2019 - Tue Feb 12 00:00:00 EST 2019 | ,
Webinar: BGA and Area Array Process Defects - Causes & Cures
Career Center | Alta Loma, California | Engineering,Quality Control,Research and Development
Rigid and Flexible Printed Circuits Plating and Metal Finishing Operations Six Sigma Work Instruction Documentation Process Development Equipment Selection and Specification New Facility Startup Air, Water and Hazardous Waste Environmental Reporting
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk
SMTnet Express, September 7, 2017, Subscribers: 30,782, Members: Companies: 10,712, Users: 23,761 Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift Young K. Song and Vanja Bukva; Teledyne DALSA As a surface finish for PCBs
construction including copper layers, barrel plating and porosity. The interaction between the PCB and the selective soldering process and heat flow characteristics within thermally challenging multi-layer boards will be defined
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