Industry Directory: selective gold plating (35)

Utilise Gold

Industry Directory |

Utilise Gold contains an international business directory of suppliers of precious metal materials used in the electronics industry, including contacts, plating salts, pastes, solders, bonding wires and evaporation materials.

Hongkong Delta Electronics Technology Co.,Ltd

Industry Directory | Manufacturer of Bare PCBs / Contract Manufacturer

Professional, Reliable,High Quality,Low Cost, Rapid Delivery PCB manufacturer

New SMT Equipment: selective gold plating (4678)

Jetting Pump - NCM5000

Jetting Pump - NCM5000

New Equipment | Dispensing

Jetting Simplified Jetting pumps are excellent for dispensing small volumes of fluid at high rates of speed. The NCM5000 simplifies jetting to its basic elements - this means easy set up, cleaning, and maintenance for you. The drive system is design

GPD Global

Small Part Tips

Small Part Tips

New Equipment | Hand Assembly

Virtual Industries offerings of small parts tips allows a person to easily handle parts as small as 100 microns (0.004"). There are nine different tip sizes for handling a variety of part sizes.  Small die can be picked up from the side, top or other

Virtual Industries, Inc.

Electronics Forum: selective gold plating (739)

soldering to thick gold plating

Electronics Forum | Wed Jul 12 11:26:12 EDT 2006 | flipit

Hi, I believe you have classic gold imbrittlement here. With 80 microinches of gold you are way over the limit. You can try to reflow longer time and at a higher temperature. The gold does not melt into the solder joint. The gold dissolves into

Poor reflow over gold plating

Electronics Forum | Wed Jun 29 16:25:51 EDT 2005 | mattkehoe

When discussing this with the customer he said that his vendor recommended a hard gold plating finish on the board due to the BGA. I said "hard gold"??? And he said yes, hard gold. Turns out the boards were plated with hard gold, not ENIG. Thank

Used SMT Equipment: selective gold plating (8)

DEK automatic solder paste printing machine

DEK automatic solder paste printing machine

Used SMT Equipment | Pick and Place/Feeders

DEK 03IX automatic solder paste printing machine features advanced up/down k-view vision system, independent control and adjustment of lighting, high-speed moving lens, accurate alignment of PCB PCB and net board. The DEK Horizon 03IX automatic solde

KingFei SMT Tech

Yamaha YAMAHA Chip Mounter

Yamaha YAMAHA Chip Mounter

Used SMT Equipment | Pick and Place/Feeders

Model :YCPII PCB size :length 330 x width 250mm ~ length 50 x width 50mm *Includes automatic adjustment of PCB width Printing head group Double scraper head group (Selection of scraper material: metal or rubber) Printing speed: 2 ~ 200mm/

Qinyi Electronics Co.,Ltd

Industry News: selective gold plating (244)

Naveen Ravindran, ZESTRON Americas, to Present at SMTAI

Industry News | 2017-09-07 17:45:03.0

ZESTRON is pleased to announce that Naveen Ravindran, M.S.Ch.E, Application Engineer will present “PCB Surface Finishes and the Cleaning Process - A Compatibility Study” at SMTA International 2017, in Rosemont, IL.

ZESTRON Americas

Virtual Industries Debuts VSPT Series of Small Parts Tips

Industry News | 2008-07-30 23:24:03.0

COLORADO SPRINGS, CO � July 29, 2008 � Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, introduces the VSPT0803 small part tip.

Virtual Industries, Inc.

Parts & Supplies: selective gold plating (241)

Yamaha Assembleon 56W Air Valve 9965 000 03807 Valve Up - Down Select KV8-M7162-10X A040-4E1-56W

Yamaha Assembleon 56W Air Valve 9965 000 03807 Valve Up - Down Select KV8-M7162-10X A040-4E1-56W

Parts & Supplies | General Purpose Equipment

37. 5322 466 12047 peel-off plate 16mm PLATE STEEL 5322 360 40471 BDA-16x25,KONGANE1 CYLINDER PISTON 5322 132 00032 /Nozzle Station Fibre 5322 130 10062 /Nozzle Station Fibre 5322 130 10069 /SENSOR Conveyor in/out 1-3 5322 380 10285 /Multi-came

KingFei SMT Tech

Juki Juki 750 101 smt nozzle

Juki Juki 750 101 smt nozzle

Parts & Supplies | SMT Equipment

Juki 750 101 smt nozzle Description: Brand:JUKI Color:plated gold Material:imported steel Nozzle model:101 102 103 104 105 106 Application:Juki 750 smt machine Customize:yes Nozzle advantage: 1.The nozzle main body adopts imported steel, i

KingFei SMT Tech

Technical Library: selective gold plating (15)

Platings for Interconnections

Technical Library | 2019-06-04 10:19:46.0

Interconnection technology relies very heavily on the ability of the conductors on a printed wiring assembly to maintain reliable signal integrity. Harsh environmental factors can precipitate a loss of conductivity due to oxidation and corrosion. Connections are typically soldered or inserted using pressure fitted connectors to obtain enough surface contact to meet the electrical conductivity requirements. In pressure contacts, surface integrity is especially critical where the abrasive effects of retraction and insertion can wear off the metallic finish from the contact area. This can expose the underlying copper or nickel and lead to increased resistance at the contact points. These types of conductors are frequently found in card edge connectors where the terminations are plated with a layer of nickel and gold (frequently referred to as gold fingers). A hard gold is typically used containing very small amounts of nickel and cobalt to increase the wear resistance.

ACI Technologies, Inc.

Wedge Bonding Tool Selection

Technical Library | 2019-05-23 10:30:22.0

Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1.

ACI Technologies, Inc.

Videos: selective gold plating (44)

Jetting Pump (NCM5000) dispenses glue

Jetting Pump (NCM5000) dispenses glue

Videos

http://www.gpd-global.com This high speed Simplified Jetting Pump consists only two wetted parts, very easy to setup and clean. Efficient. NCM5000 Jetting pump dispenses surface mount glue / adhesive with excellent result. Watch this video. More In

GPD Global

Example of how to import CAD data and BOM files, and export to an assembly machine program set up file.

Example of how to import CAD data and BOM files, and export to an assembly machine program set up file.

Videos

www.unisoft-cim.com/pcbplace.htm - The ProntoPLACE module from Unisoft is used by electronics manufacturers to generate the necessary programs for automatic PCB assembly machines in minutes. ProntoPLACE programs most popular surface mount (SMT) place

UNISOFT Corporation

Training Courses: selective gold plating (3)

IPC-6012 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-6012 Specialist (CIS)

The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.

Blackfox Training Institute, LLC

5-Day Hand Soldering, Rework & Repair Certification Training

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: selective gold plating (5)

Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies

Events Calendar | Wed Apr 20 00:00:00 EDT 2022 - Wed Apr 20 00:00:00 EDT 2022 | ,

Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies

Surface Mount Technology Association (SMTA)

Webinar: BGA and Area Array Process Defects - Causes & Cures

Events Calendar | Tue Feb 12 00:00:00 EST 2019 - Tue Feb 12 00:00:00 EST 2019 | ,

Webinar: BGA and Area Array Process Defects - Causes & Cures

Surface Mount Technology Association (SMTA)

Career Center - Resumes: selective gold plating (9)

Jerry McBeth Resume

Career Center | Alta Loma, California | Engineering,Quality Control,Research and Development

Rigid and Flexible Printed Circuits Plating and Metal Finishing Operations Six Sigma Work Instruction Documentation Process Development Equipment Selection and Specification New Facility Startup Air, Water and Hazardous Waste Environmental Reporting

3+ years of experience in the PCB CAM engineering

Career Center | Erode, Tamilnadu India | Engineering

Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou

Express Newsletter: selective gold plating (590)

SMTnet Express - August 7, 2014

SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk

SMTnet Express - September 7, 2017

SMTnet Express, September 7, 2017, Subscribers: 30,782, Members: Companies: 10,712, Users: 23,761 Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift Young K. Song and Vanja Bukva; Teledyne DALSA As a surface finish for PCBs

Partner Websites: selective gold plating (235)

Selective Soldering Workshops

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/soldering-processes/selective-soldering-workshops

construction including copper layers, barrel plating and porosity. The interaction between the PCB and the selective soldering process and heat flow characteristics within thermally challenging multi-layer boards will be defined

ASYMTEK Products | Nordson Electronics Solutions

UV Selective Coating | ITW EAE

ITW EAE | https://www.itweae.com/applications/dispensing/uv-selective-coating

UV Selective Coating | ITW EAE Skip to main content Top menu Support Center Contact Us Request Information Search Search Search Enter the terms you wish to search for

ITW EAE


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