Industry Directory: shear strength (4)

RIVIA BLIND RIVETS

Industry Directory | Manufacturer

BLIND RIVETS,BLIND NUTS,BLIND RIVETING TOOLS,STAINLESS STEEL CABLE TIES

Plasma Etch, Inc.

Industry Directory | Manufacturer / Research Institute / Laboratory / School

Manufacturer of surface deposition and plasma surface cleaning and etching equipment offering reliable, repeatable cleaning and etching of PCBs and other materials.

New SMT Equipment: shear strength (16)

PCB separator ASCEN PCB cutting machine

PCB separator ASCEN PCB cutting machine

New Equipment | Depaneling

ASC-620 PCB separator improve the PCB’s quality maximumly. It’s use the link-pole to increase the strength, it’s been driven by a small cylinder, it’s need a little gas, but the shear force is very strong. The upper and l

ASCEN Technology

EWI SonicSolder

EWI SonicSolder

New Equipment | Assembly Services

S-Bond has been licensed as a supplier and provider of ultrasonic activated joining services using EWI SonicSolder®, an EWI patented* binary lead-free solder alloy that melts at 231°C. In conjunction with ultrasonic soldering, it can be used to join

S-Bond Technologies

Electronics Forum: shear strength (71)

reflow solder joint shear strength

Electronics Forum | Wed Jul 03 03:02:35 EDT 2013 | autoel

How to test the reflow solder joint shear strength? What are the specification to test solder joint shear strength? What are the different methods to test the solder joint shear strength? Vijayashree

reflow solder joint shear strength

Electronics Forum | Wed Jul 03 15:40:17 EDT 2013 | davef

Shear tests are [in my opinion] senseless. The shear stress you measure depends more on the shear rate and on the point where the force is applied than on the grain structure. When shearing a component, you not only apply shear stress, but also roll

Used SMT Equipment: shear strength (1)

CONTACT SYSTEMS SM-2009

CONTACT SYSTEMS SM-2009

Used SMT Equipment | Circuit Board Assembly Products

The product introduction The SM-2009 scissors & pneumatic type separator, we use the most advanced non-stress idea to designed it, it’s help to prevent the chap phenomena as the PCB separated by the general separator, it’s improve the PCB’s quality

Shenzhen Sam Electronic Equipment Co.,Ltd

Industry News: shear strength (22)

SHENMAO Features Laser Soldering Paste at IPC APEX 2016

Industry News | 2016-02-25 14:29:00.0

SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.

Shenmao Technology Inc.

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces Laser Soldering Paste

Industry News | 2016-05-31 20:58:06.0

SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.

Shenmao Technology Inc.

Technical Library: shear strength (8)

Effect of BGA Reballing and its Influence on Ball Shear Strength

Technical Library | 2013-07-11 15:22:40.0

This research paper will focus on the effect of various parameters that are used to reball a BGA and their effect on the overall shear strength. Factors that will be looked at include the type of BGA (SAC305 or 63Sn/37Pb), the alloy used to reball (SAC405 or 63Sn/37Pb), the type of flux used (Water Soluble or No Clean), and the environment in which reballing takes place (Nitrogen or Ambient).

MARTIN (a Finetech company)

Evaluating the Mechanical Reliability of Ball Grid Array (BGA) Flexible Surface-Mount Electronics Packaging under Isothermal Ageing

Technical Library | 2015-02-12 16:57:56.0

Electronic systems are known to be affected by the environmental and mechanical conditions, such as humidity, temperature, thermal shocks and vibration. These adverse environmental operating conditions, with time, could degrade the mechanical efficiency of the system and might lead to catastrophic failures.The aim of this study is to investigate the mechanical integrity of lead-free ball grid array (BGA) solder joints subjected to isothermal ageing at 150°C for up to 1000 hours. Upon ageing at 150°C the Sn-3.5Ag solder alloy initially age-softened for up to 200 hours. This behaviour was linked to the coarsening of grains. When aged beyond 200 hours the shear strength was found to increase up to 400 hours. This age-hardening was correlated with precipitation of hard Ag3Sn particles in Sn matrix. Further ageing resulted in gradual decrease in shear strength. This can be explained as the combined effect of precipitation coarsening and growth of intermetallic layer. The fractured surfaces of the broken solder balls were also investigated under a Scanning Electron Microscope. The shear failures were generally due to ductile fractures in bulk solders irrespective of the ageing time.

School of Engineering, University of Greenwich

Videos: shear strength (4)

PCB cutting machine , PCB separator , PCB depaneling machine, PCB V-cut separator, auto PCB separator

PCB cutting machine , PCB separator , PCB depaneling machine, PCB V-cut separator, auto PCB separator

Videos

link:https://www.ascen.ltd/Blog/Solutio/493.html ASCEN PCB separator ASC-620 PCB cutting machine can use for cutting LED long board and also can use to the PCBA with the high component separate operation.It is the best way to replace the way to purch

ASCEN Technology

Testing Machine

Testing Machine

Videos

Model WDD, WDW,WDW-S, WDW-E, WDW-D Series Computer Control Electromechanical Universal Testing Machine Applications Computer Control Electromechanical Testing Machines are designed and manufactured according to ASTM, ISO, DIN, GB etc standards. I

Jinan Scientific Test Technology Co., Ltd.

Career Center - Resumes: shear strength (1)

BankeemChheda-Resume

Career Center | Rochester, New York USA | Engineering

I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research

Express Newsletter: shear strength (70)

SMTnet Express July 11 - 2013, Subscribers: 26149

SMTnet Express July 11, 2013, Subscribers: 26149, Members: Companies: 13418, Users: 34911 Effect of BGA Reballing and its Influence on Ball Shear Strength by S. Manian Ramkumar Ph.D., Andrew J. Daya, Daniel B. Lewanda; Rochester Institute

Strength of Lead-free BGA Spheres in High Speed Loading

Strength of Lead-free BGA Spheres in High Speed Loading Strength of Lead-free BGA Spheres in High Speed Loading Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general

Partner Websites: shear strength (311)

SolderTips: Defining Shear Forces for Surface Mounted Components | EPTAC

| https://www.eptac.com/soldertips/defining-shear-forces-for-surface-mounted-components/

: The IPC does not have any specification that discusses the strength or shear forces of solder or components mounted onto pads or into plated through holes

Microstructure and Performance of Micro CU Pillars Assemblies

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4722

. Thus, behaviors of Cu pillar packages during Accelerated Thermal Cycling (ATC) were examined. Correlations between the shear strength and microstructure of Cu pillars were examined for different solder compositions, and for different aging times

Surface Mount Technology Association (SMTA)


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