Industry News: shear strength (Page 1 of 2)

SHENMAO Features Laser Soldering Paste at IPC APEX 2016

Industry News | 2016-02-25 14:29:00.0

SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.

Shenmao Technology Inc.

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces Laser Soldering Paste

Industry News | 2016-05-31 20:58:06.0

SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.

Shenmao Technology Inc.

Krayden, Inc. Provides Permabond’s Structural Adhesive and Magnet Bonder

Industry News | 2010-06-04 17:36:28.0

DENVER — Krayden, Inc., a leading distributor of engineered materials, introduces the Permabond TA459 magnet adhesive that is non-corrosive to electrically conductive surfaces including copper.

Krayden Inc.

Christopher Associates and Koki Announce Patented S01X7C48-M500 High-Reliability Low-Ag Lead-Free Solder Paste

Industry News | 2011-01-26 20:33:39.0

Christopher Associates announced today the introduction of Koki’s S01X7C48-M500 High-Reliability Low-Ag Lead-Free Solder Paste. In response to the rise in the cost of metal, particularly silver, Koki has developed a lower cost alternative.

Christopher Associates Inc.

New Henkel Electrically Conductive Adhesive Cures Fast at Low Temperature; Ideal for Photovoltaic, Automotive and Membrane Switch Applications

Industry News | 2010-05-12 13:12:33.0

Delivering a robust alternative to high-temperature solder processes, Henkel has developed Hysol ECCOBOND CA3556HF, a silver-filled electrically conductive adhesive designed to offer fast cure at low temperature. The material is ideal for high-throughput production processes and applications that dictate high peel strength, such as the assembly of photovoltaic (PV) modules, automotive sensors and membrane switches that incorporate temperature-sensitive substrates.

Henkel Electronic Materials

Advances in Thin, 3D and MEMS Die Bond Strength Testing

Industry News | 2017-08-02 07:12:18.0

As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome:

XYZTEC bv

SHENMAO Presents Technical Paper at SMTA/ICSR Conference

Industry News | 2016-04-21 00:17:09.0

SHENMAO Technology will present the technical paper "A New Dispensing Solder Paste for Laser Soldering Technology" at the 10th. Anniversary of the SMTA International Conference of Soldering and Reliability 2016 in Toronto, Canada, featuring advancements in newly developed composition of Powder, Fluxes and produces best dispensability, minimal flux residue, no-splash or solder balling issues and minimal and smaller voids.

Shenmao Technology Inc.

YINCAE's New SMT 158N Series withstanding -273°C

Industry News | 2021-02-24 11:47:14.0

YINCAE is excited to announce that we have developed SMT 158N series, including a non-flow, low temperature slow cure and high purity liquid epoxy underfill and capillary underfill encapsulant.

YINCAE Advanced Materials, LLC.

Cobar Expert Gerjan Diepstraten to Discuss Reflow Soldering during IPC Midwest 2012 Conference

Industry News | 2012-07-25 15:16:14.0

The Balver Zinn Group announces that Cobar BV’s Gerjan Diepstraten will present a paper titled “Reflow Soldering Equals Wave Soldering Plus One” at the upcoming IPC Midwest Exhibition & Conference

Balver Zinn

AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications

Industry News | 2014-09-05 13:53:06.0

AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications. AI Technology, Inc. (AIT) has recently developed a series of temporary wax-like media that has been proven to be useful in many of these thinning applications.

AI Technology, Inc. (AIT)

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