Industry News | 2012-02-15 19:18:44.0
GPD Global announces that its PCD4H Dispense Pump yields excellent results with phosphor and non-phosphor-filled LED encapsulation as viewed on the color chart by tightly grouped results.
Industry News | 2003-03-14 08:54:29.0
The action is part of its continuing efforts to serve its many loyal customers, the company said.
Industry News | 2003-03-27 08:15:33.0
Modular Embedded Circuit Board from parvus Enables Local Device Fingerprint Biometrics
Industry News | 2018-02-19 13:55:53.0
IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.
Industry News | 2020-07-01 12:08:16.0
For high precision low stress PCB singulation of panels with sensitive components near the parting edge, and with the smooth edge finish required by military specifications or by packaging considerations, using a Diamond Blade Saw beats routing for speed and for blade life. The saw blade, a 2.95" (75mm) diameter .021" thick diamond coated cutting disk, provides a low-stress, ultra smooth edge finish for separting panelized Printed Circuit Cards. ts which overhang the parting line will remain intact.
Industry News | 2023-04-17 08:38:56.0
IPC is now accepting abstracts for the High Reliability Forum, the international conference focusing on Class 3 and safety critical electronics for mil-aero, automotive, medical, and long-life applications that are subjected to harsh use environments. The High Reliability Forum will be held October 17-19, 2023, at the Hilton Baltimore BWI Airport in Linthicum (Baltimore), Md.
Industry News | 2023-07-22 06:38:49.0
Explore the Ultimate SMT Solution for Underwater Drones - Unmatched Performance and Precision. Discover cutting-edge technology and enhance your underwater drone's capabilities today. Dive into the future of subaquatic exploration with our advanced SMT solutions!
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
Industry News | 2023-04-26 08:28:03.0
Computers and mobile phones are the most common electronic products in our daily life. They all adopt modern electronic technology and communication technology, providing great convenience and entertainment for people.
Industry News | 2013-07-09 14:17:09.0
IPC — Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders worldwide to submit abstracts for the 13th Electronic Circuits World Convention (ECWC13) taking place May 7–9, 2014, at the Nuremberg Convention Center, Germany.
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
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