Express Newsletter: shinkawa die-bonder (13)

Partner Websites: shinkawa die-bonder (25)

ACI Technologies, Inc

ACI Technologies, Inc. | https://www.aciusa.org/wp-content/uploads/2021/07/techtip3-2017.pdf

. The power packaging laboratory has the capability to stack package on package as well as die stacking. Using a die bonder, die can be placed at an accuracy of

ACI Technologies, Inc.

Online Auction – June 3 - 5, 2014 (Featuring Items From OneChip Photonics) - Baja Bid LLC

Baja Bid | https://bajabid.com/global-online-auction-order-onechip-photonics-june-3-5-2014/

: Finetech Lambda Flip Chip Bonder, Averna Life Test System, Royce DE35-ST Semi-Automatic Die Handler, Royce MP300 Die Sorter, Spirent SPT-2U TestCenter, Test Equity 1007S Temperature Chambers, Agilent

Baja Bid


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Non-heated dispensing system

Easily dispense fine pitch components with ±25µm positioning accuracy.
PCB Handling Machine with CE

Software for SMT placement & AOI - Free Download.
2023 Eptac IPC Certification Training Schedule

World's Best Reflow Oven Customizable for Unique Applications