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. The power packaging laboratory has the capability to stack package on package as well as die stacking. Using a die bonder, die can be placed at an accuracy of
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: Finetech Lambda Flip Chip Bonder, Averna Life Test System, Royce DE35-ST Semi-Automatic Die Handler, Royce MP300 Die Sorter, Spirent SPT-2U TestCenter, Test Equity 1007S Temperature Chambers, Agilent
