New SMT Equipment: siemens has, far, f5 (7)

1492-AIFM16-F-3

1492-AIFM16-F-3

New Equipment | Industrial Automation

1492-AIFM16-F-3 1492-AIFM16-F-3   ZhongHaiDe (Fujian) Industrial Equipment Co., a professional equipment supplier in domestic automation. It was established in 2014 in Fuzhou, Fujian province. With the

zhonghaide(fujian)industrial equipmentCO.,LTD.

3500/61

3500/61

New Equipment | Industrial Automation

Bently Nevada* Asset Condition Monitoring Contact: Sandy Lin  mailto:unity@mvme.cn Skype: live:onlywnn_1 Telegram:+8618020776786 Mobile: (+86)-18020776786 QQ :2851195456 Bently Nevada 3500/15 AC/DC POWER SUPPLY  The 3500/15 Power Supply is a

Moore Automation

Electronics Forum: siemens has, far, f5 (1)

Re: Siemens HS50 and F5 and S25

Electronics Forum | Mon Nov 27 19:00:52 EST 2000 | Christopher Noonan

When the are up and running they are hard to beat, but when they go down they go down hard. Keep field service close. Don't get me wrong they're great machines and the company I used to work for had some of the first machines available. I come fro

Technical Library: siemens has, far, f5 (3)

Pad Cratering Susceptibility Testing with Acoustic Emission

Technical Library | 2015-08-13 15:52:40.0

Pad cratering has become more prevalent with the switch to lead free solders and lead free compatible laminates. This mainly is due to the use of higher reflow temperature, stiffer Pb-free solder alloys, and the more brittle Pb-free compatible laminates. However, pad cratering is difficult to detect by monitoring electric resistance since pad cratering initiates before an electrical failure occurs. Several methods have been developed to evaluate laminate materials' resistance to pad cratering. Pad-solder level tests include ball shear, ball pull and pin pull. The detailed methods for ball shear, ball pull, and pin pull testing are documented in an industry standard IPC-9708. Bansal, et al. proposed to use acoustic emission (AE) sensors to detect pad cratering during four-point bend test. Currently there is an industry-working group working on test guidelines for acoustic emission measurement during mechanical testing.

Agilent Technologies, Inc.

Electromigration Damage Mechanics of Lead-Free Solder Joints Under Pulsed DC: A Computational Model

Technical Library | 2013-06-13 15:31:24.0

Electromigration (EM) is a mass transportation mechanism driven by electron wind force, thermal gradient, chemical potential and stress gradient. According to Moore’s law, number of transistors on integrated circuits (ICs) doubles approximately every 2 years. Moore’s law holds true since its introduction in 1970s. This insatiable demand for smaller ICs size, larger integration and higher Input/Output (IO) count of microelectronics has made ball grid array (BGA) the most promising connection type in electronic packaging industry. This trend, however, renders EM reliability of solders joints a major bottleneck to hinder further development of electronics industry...

Electronic Packaging Laboratory, State University of New York

Express Newsletter: siemens has, far, f5 (172)

Partner Websites: siemens has, far, f5 (13)

Pick and Place Archives - Page 2 of 3 - Lewis and Clark

| https://www.lewis-clark.com/product-tag/pick-and-place/page/2/

. Location & Shipping:   USA/ FOB Origin Siemens Siplace F5 Pick and Place-2007 Make:  Siemens Model:  F5 Vintage: 2007 Details: Single IC Head 12 Segment RV Head DLM1 Single Gantry Nozzle Changer for both Heads (3

Component Cracking-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_bulletin,23576&url=_print

Component Cracking-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> News Component Cracking Component Cracking Cracking of multilayer ceramic capacitors has been attributed to excessive heating rates during reflow


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