Industry Directory: silicon wafer (19)

GES Associates LLC

GES Associates LLC

Industry Directory | Equipment Dealer / Broker

GES buys and sells equipment as guaranteed functional, refurbished, or "as is" depending on customers’ needs. GES maintains an extensive equipment inventory, conducts auctions, and equipment sourcing.

UniversityWafer, Inc.

Industry Directory | Distributor

UniversityWafer is a leading silicon wafer and semiconductor substrate supplier to for academia and industry. We provide high-quality, low cost wafers in small and large quantities. Why buy wafers in volume when you don't to!

New SMT Equipment: silicon wafer (98)

IntelliJet Jetting System with ReadiSet Jet Cartridge

IntelliJet Jetting System with ReadiSet Jet Cartridge

New Equipment | Dispensing

The IntelliJet® Jetting System with ReadiSet™ Jet Cartridge delivers cutting-edge reliability and micro dot dispensing for manufacturing advanced semiconductor and mobile electronics packages ReadiSet Jet Cartridge reduces operator training time,

Nordson ASYMTEK

MICRONOX® MX2302 Wafer-level Cleaning Solution

MICRONOX® MX2302 Wafer-level Cleaning Solution

New Equipment | Cleaning Agents

MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302

KYZEN Corporation

Electronics Forum: silicon wafer (2)

Re: Wafer Reflow Profile

Electronics Forum | Tue Feb 02 09:51:38 EST 1999 | Justin Medernach

Hello Everybody: I am in urgent need of some information regarding the reflow profile for a flip chip wafer. Would the reflow conditions along with the flux used affect the appearence of the solder joints. We are witnessing dull solder j

Books for SMT

Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef

DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b

Used SMT Equipment: silicon wafer (1)

Kulicke&Soffa Industries 7500

Kulicke&Soffa Industries 7500

Used SMT Equipment | Semiconductor & Solar

·  Dual Magnification, auto-focusing Optical System ·  DC brushless, 60,000 RPM closed-loop speed-controlled Air Bearing Spindle ·  Front loaded dual Cassette Compartment ·  Inspection Drawer - also used for single wafer load/unload ·  Dress Wafe

LEL Tech

Industry News: silicon wafer (96)

ZESTRON to Exhibit at SMTA Silicon Valley

Industry News | 2017-11-16 16:03:40.0

ZESTRON will feature our latest cleaning technology, HYDRON® Technology, at the SMTA Silicon Valley Expo and Tech Forum on November 29th.

ZESTRON Americas

ZESTRON to Exhibit at SMTA Silicon Valley Expo and Tech Forum

Industry News | 2018-11-21 20:08:02.0

ZESTRON will be featuring its leading cleaning technologies HYDRON®, MPC®, and FAST® at the SMTA Silicon Valley Expo and Tech Forum.

ZESTRON Americas

Parts & Supplies: silicon wafer (14)

Juki Black Juki Spare Parts UKI 40046786 FX-3 CABLE BEAR X TSUBAKI TKP0450 58B R95

Juki Black Juki Spare Parts UKI 40046786 FX-3 CABLE BEAR X TSUBAKI TKP0450 58B R95

Parts & Supplies | SMT Equipment

Specifications: Brand Name JUKI PLASTIC RAIL Part number 40046786 Model TSUBAKI TKP0450 58B R95 Ensure Test in machine confirmation Guarantee 1 month usage for machine FX-3 FX-3R Supply all JUKI motors at lower price JUKI 40034750 R3

KingFei SMT Tech

Juki 750 Watt JUKI FX-1 Y Axis Motor HC-MFS73-S14 JUKI Servo Motor L809E0210A0

Juki 750 Watt JUKI FX-1 Y Axis Motor HC-MFS73-S14 JUKI Servo Motor L809E0210A0

Parts & Supplies | Assembly Accessories

Detailed Product Description Part Number: L809E0210A0 Brand: Mitsubishi Part Name: Y Axis Motor Power: 750W Original: Japan Model: HC-MFS73-S14 750 Watt JUKI FX-1 Y Axis Motor HC-MFS73-S14 JUKI Servo Motor L809E0210A0 1. For JUKI FX1 SMT Machine

KingFei SMT Tech

Technical Library: silicon wafer (72)

Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum

Technical Library | 2020-01-28 00:23:58.0

This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.

Heller Industries Inc.

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Technical Library | 2021-01-03 19:24:52.0

Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.

SMTnet

Videos: silicon wafer (2)

IWLPC 2018

IWLPC 2018

Videos

IWLPC brings together the semiconductor industry’s most respected authorities to address all aspects of wafer-level, 3D device packaging, advanced manufacturing & test technologies. Addressing wafer-level packaging, 3D, and Advanced Manufacturing &

Surface Mount Technology Association (SMTA)

Introduction to Machine Vision Part 1, Definition & Applications

Introduction to Machine Vision Part 1, Definition & Applications

Videos

This is the first in a series of 10-minute videos to introduce new users to the basics of machine vision technology. In this video, users will learn what machine vision is, how it is used in factory automation, and its four most common applications.

Microscan

Events Calendar: silicon wafer (3)

International Wafer-Level Packaging Conference (IWLPC)

Events Calendar | Tue Oct 13 00:00:00 EDT 2020 - Thu Oct 15 00:00:00 EDT 2020 | San Jose, California USA

International Wafer-Level Packaging Conference (IWLPC)

Surface Mount Technology Association (SMTA)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Career Center - Resumes: silicon wafer (3)

SMT process engineer

Career Center | NORTHRIDGE, California USA | Engineering

EDUCATION BS Electronics and Communication Engineering                Gujarat University MS Electrical Engineering        California State University, Northridge  ACADAMIC PROJECT Fabrication and Characterization of Silicon Carbide (SiC) MESFE

Quality Control/Production and Management

Career Center | Melbourne, Florida USA | Management,Production,Quality Control

Technical Skills/Abilities: � Management � Quality Assurance � Strong Troubleshooting Skills � Strategic Planning � Employee Training � Quality Assurance � Problem Resolution � Mechanical/Technical Aptitude

Express Newsletter: silicon wafer (131)

Wafer-Level Packaged MEMS Switch With TSV

Wafer-Level Packaged MEMS Switch With TSV Wafer-Level Packaged MEMS Switch With TSV by: Nicolas Lietaer, Thor Bakke, Anand Summanwar; SINTEF , Per Dalsjø, Jakob Gakkestad; Norwegian Defence Research Establishment (FFI), Frank Niklaus; KTH - Royal

Partner Websites: silicon wafer (103)

Wafer Inspection and Metrology

Nordson ASYMTEK | https://www.nordson.com/en/divisions/dage/wafer-inspection-and-metrology

range of inline and lab based X-ray inspection and metrology solutions for assessing and monitoring wafer level quality. Check shape, fill level and voiding in TSV through silicon vias

Nordson ASYMTEK

Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2020/02/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf

. Often it induces fatal interconnection defects and initiates a weak connection between the silicon die and substrate/wafer substrate and wafer package

Heller Industries Inc.


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