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Layer Count: 8L Board Thickness: 1.0mm Panel Dimension:190*86mm/2up Material: S1141 Copper on board surface: 35μm Min Hole Diameter: 0.1mm Min line Width/Space: 8/8mil Surface Finish: ENIG+Selective OSP in BGA area This quick turn PCB is manufacture
New Equipment | Assembly Services
No. Items technological Capability 1 Layer 1-20 layer 2 Copper thickness 0.5-4.0oz 3 Board thickness 0.2mm-6.0m
Electronics Forum | Fri Aug 26 09:57:21 EDT 2005 | russ
The Immersion gold is not a problem with BGAs specifically but "black pad" which can be present anywhere. The unfortunate thing with BGAs is you cannot see it. Personally I hate white tin. It is okay for single sided boards running no-clean, but c
Electronics Forum | Mon Jun 26 08:08:32 EDT 2006 | davef
It does make you think the immersion coating is causing the voiding, doesn't it? We never have seen that.
Industry News | 2003-04-10 10:27:46.0
IPC and JEDEC Send Out Call for Papers
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Technical Library | 2018-07-11 22:46:13.0
For a demanding automotive electronics assembly, a highly thermal fatigue resistant solder alloy is required, which makes the lead-free Sn-Ag-Cu type solder alloy unusable. Sn-Ag-Bi-In solder alloy is considered as a high reliability solder alloy due to significant improvement in thermal fatigue resistance as compared to a standard Sn-Ag-Cu alloy. The alloy has not only good thermal fatigue properties but it also has superior ductility and tensile strength by appropriate addition of In; however, initial results indicated a sub-par performance in joint reliability when it is soldered on a printed circuit board (PCB) with Electroless Nickel Immersion Gold (ENIG) surface finish. Numerous experiments were performed to find out appropriate alloying element which would help improve the performance on ENIG PCBs. Sn-Ag-Bi-In solder alloys with and without Cu additions were prepared and then tests were carried out to see the performance in a thermal fatigue test and a drop resistance test.to investigate the impact of Cu addition towards the improvement of joint reliability on ENIG finish PCB. Also, the mechanism of such improvement is documented.
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
] Investigation Specifics: 84 I/O Plastic CSP, daisy chained, 0.3mm (12 mil) diameter solderballs Sn63 solder paste Test vehicle: Characteristics not available, Immersion Silver (IAg) and ENIG finishes Thermal cycling: 0°C-100
Imagineering, Inc. | https://www.pcbnet.com/blog/the-role-of-pcb-assembly-and-fabrication-in-the-aerospace-industry/
with immersion gold coating (ENIG) and immersion silver. Hot air solder leveling (HASL) is a type of PCB finish that involves dipping the PCB into molten solder, which covers exposed copper surfaces. The PCB is then passed between hot air knives to
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