Qualitek International, Inc. presents Ecolloy the future of high performance lead free silver free solder. Ecolloy has a higher tensile strength and temperature cycling than SAC 305 and SnCu alloys. Melting range of this new alloy is lower than SnCu
Delta 99C Alloy = Sn/Cu/Ni/Ge has been developed to replace costly silver alloys in the soldering process. It’s widely used composition is an ideal drop in replacement for those currently using SAC and other lead free alloys. Contains no
Electronics Forum | Fri Jun 09 10:01:39 EDT 2017 | jkitt84
Ed, this is great info. Thanks. Jeff
Electronics Forum | Thu Jun 08 09:43:42 EDT 2017 | davef
You know the scary part about your mentioning a tread where I post something? Well. let's just say that 2007 was a long time ago. Anyhow, silver will dissolve into your solder and provide no barrier. Some people apply a silver flash plating over the
Koh Young Ky8030-2 Solder Paste Inspection Machine D.O.M: 5/2012 Key Features: Innovation 3D Solutions for PCB Warp including Z-Tracking Technology and Pad Referencing Technology Renewal GUI features simple touchscreen operation that maximizes th
Features 1. Uses the high accuracy timing control electric circuit to guarantee dispensing evenly. 2. .Have vacuum Suck-back ensures no dripping. 3. Operation simple, Adjustment and replacement mold is easily. 4. Based on the size of oval
Industry News | 2017-09-07 17:45:03.0
ZESTRON is pleased to announce that Naveen Ravindran, M.S.Ch.E, Application Engineer will present “PCB Surface Finishes and the Cleaning Process - A Compatibility Study” at SMTA International 2017, in Rosemont, IL.
Camalot - Single Silver Solder - Gauge 25, ID 0.01, Gap 0.005
Camalot - Single Silver Solder - Gauge 22, ID 0.016, Gap 0.008
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
Qualitek International, Inc. presents Ecolloy the future of high performance lead free solder. Ecolloy has a higher tensile strength and temperature cycling than SAC 305 and SnCu alloys. Melting range of this new alloy is lower than SnCu alloys so it
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SMTnet Express, Septemeber 1, 2016, Subscribers: 26,288, Companies: 14,937, Users: 41,025 Reliability Study of Low Silver Alloy Solder Pastes Jennifer Nguyen, David Geiger and Murad Kurwa; Flex (Flextronics International) Sn3.0Ag0.5Cu (SAC305
SMTnet Express, October 2, 2014, Subscribers: 23352, Members: Companies: 14077, Users: 36923 Assembly Process Feasibility of Low/No Silver Alloy Solder Paste Materials Jennifer Nguyen Ranilo Aranda, David Geiger, and Murad Kurwa; Flextronics
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load-bearing applications. Hard (Silver) Soldering (>450 °C) [>842 o F] Brass or silver, hence the name “silver soldering”, is used for this bonding metal process