Industry News: single and magazine and unloader and u-170s (Page 1 of 1)

Nordson MARCH Receives Vision and Innovation Awards at NEPCON China for its RollVIA Self-contained Vacuum Plasma System

Industry News | 2018-05-31 10:23:37.0

Nordson MARCH announces that it has received the VISION Award from SMT China magazine and the Innovation Award from Electronics Manufacturing (EM) Asia magazine for its new-generation RollVIA™ plasma system. The awards were presented at NEPCON China, held in the Shanghai EXPO World Center, Shanghai, China, on April 24 and 25, 2018. The RollVIA™ plasma system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during printed circuit board (PCB) production. The RollVIA provides uniform plasma treatment of substrates as thin as 25 microns.

Nordson MARCH

Machine Vision Products to Introduce their latest Die Wire, Wire-Bond Inspection and Automated Semiconductor Inspection Solutions at Semicon West 2017

Industry News | 2017-07-07 17:15:03.0

Carlsbad, CA – July 7, 2017: Machine Vision Products (MVP) today announced it would be demonstrating its Die Wire Metrology System (DWMS) and Semiconductor Automated Optical Inspection solutions at the Semicon West exhibition. These latest capabilities are available on MVP's 2020 and 850G Platforms. Applications demonstrated will include die wire metrology, wire bond, wafer and surface inspection capabilities. The exhibition is at the Moscone Center in San Francisco from July 11-13, 2017. Machine Vision Products are exhibiting at booth #7724 in the West Hall (Level 1).

Machine Vision Products, Inc

Machine Vision Products to Demonstrate Diverse Microelectronics and Packaging Inspection Toolbox of its Microelectronics AOI Platforms at Semicon West 2016

Industry News | 2016-07-08 19:09:41.0

Carlsbad, CA – July 8: Machine Vision Products (MVP) today announced it would be demonstrating their diverse inspection toolbox on the MVP 850 Platform for Microelectronics and Packaging at the Semicon West 2016 exhibition. Applications will include Lead Frame inspection for die placement, epoxy and wire bond as well as demonstrating new surface inspection capabilities. The exhibition is at the Moscone Center in San Francisco from July 12-14 2016. Machine Vision Products are exhibiting at booth #6471 in the North Hall.

Machine Vision Products, Inc

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