ZK Electronic Technology Co., Limited professional in Surface-Mount Technology area and supports most major brands of electronic asembly equipments with a large selections of compatible SMT.
JINSUNG ELECTRONICS CO. designs and manufactures the customized Printed Circuit Board(PCB) based in South Korea since 1995 throughout types of Single-sided, Double-sided, Multilayer, Flex, Rigid-Flex.
Technically speaking, iineo is a multi function SMT Pick & Place platform , with the highest level of flexibility and feeder count in the industry. It is widely configurable without the need to compromise on feeder count, placement speed or component
Our xpii platform is a refreshing new approach to modular pick and place. Incorporating technology from Europlacer’s innovative award winning iineo platform, xpii benefits from low maintenance linear motors, high resolution digital cameras and advanc
Electronics Forum | Fri Apr 02 14:11:21 EDT 2010 | bigdaddysoy9
Manjunath, I prefer orthogonal systems. In my experience they are actually better at detecting coplanarity and HIP defects than multi camera systems. They are obviously limited, in that they can not inspect a component under another component, b
Electronics Forum | Thu Mar 14 19:08:56 EST 2002 | stevezeva
Hi ya'll! I know this is going to be an extreme longshot, but I'm in desperate need of a Assemblion Emerald 54mm front light camera mirror (part number 5322-380-10285). Ours got cracked somehow (still haven't found out how, probably never will...
Placement and solder joint inspection (reflow and wave soldering) Orthogonal camera module 8M (white LEDs): Field of view: 57.6 x 43.5 mm Resolution: 23.5 µm (standard), 11.75 µm (high) switchable with On Demand HR Number of mega pixel cameras:
FUJI, Chip Shooter, type CP643E, s.n. 2066, Left to right, cap. 40.000 CPH, Device input 140-8mm, with 20 heades, 6 nozels each, 2 tables 70 feeders each, PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm,Board Thickness: 0.3 to 4.0 mm, Component ca
Industry News | 2010-03-10 15:39:10.0
March 2010 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will display its new XPii SMT modular pick-and-place system, along with its award-winning iineo SMT platform in booth 1E03 at the upcoming NEPCON China/EMT China 2010 exhibition and conference scheduled to take place April 20-22, 2010 in Shanghai, PR China.
Industry News | 2010-03-24 13:35:52.0
APEX, NC - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will display its IINEO SMT platform, along with its new XPii-II pick-and-place unit in booth 2259 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas, NV.
KV1-M73A0-330 camera for YV100xg yamaha smt machine YAMAHA CAMERA KV7-M7210-00X CCD CAMERA YV100X MOVE CAM KGA-M7210-00X CCD CAMERA YV100XG MOVE CAM KG9-M7210-10X CCD CAMERA YV100II MOVE CAM KV8-M7310-00X L CAMERA ASSYYV100II KG9-M7210-10
KG9-M7210-10X XC-75 camera for YV100II yamaha smt machine YAMAHA CAMERA KV7-M7210-00X CCD CAMERA YV100X MOVE CAM KGA-M7210-00X CCD CAMERA YV100XG MOVE CAM KG9-M7210-10X CCD CAMERA YV100II MOVE CAM KV8-M7310-00X L CAMERA ASSYYV100II KG9-M7
Technical Library | 2008-02-20 21:42:52.0
Tier 2 and Tier 3 EMS companies face increasing pressure from competition in low-cost manufacturing countries to produce assembled boards at lower cost, with increased complexity and to tighter deadlines. They also face an increasing amount of high-mix, small-to-mediumvolume production runs. Even OEMs find it hard to predict what products they will be manufacturing in three to five years time, driving the need to invest in highly flexible production tools that will cater to their needs over the lifetime of the equipment. This paper examines methodologies for optimising the process, improving stock control and providing greater traceability using lean manufacturing techniques.
Technical Library | 2012-11-21 18:57:58.0
The continuing evolution toward advanced miniature packaging has led to ever increasing PCB density and complexity. As the manufacturing process becomes progressively more complicated, there is an ever increasing probability for defects to occur on finished PCB assemblies. For years the Automated Optical Inspection (AOI) industry has relied solely upon two-dimensional (2D) inspection principles to test the quality of workmanship on electronic assemblies. While advancements in conventional 2D optical inspection have made this technology suitable for detecting such defects as missing components, wrong components, proper component orientation, insufficient solder, and solder bridges; there is an inherent limitation in the ability to inspect for co-planarity of ultra-miniature chips, leaded device, BGA and LED packages.
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Career Center | TRIVANDRUM, kerala India | Engineering,Maintenance,Research and Development
System Integration, Software Configuration Project Implementation & Commissioning Installation and Servicing of CCTV,Access Control,Public Address systems, Fire & Alarm Security System, Biometric Attendance System. Language Skills-C, C++,UNIX,LIN
Lipstick Camera User Guide Lipstick Camera User Guide for Single & Dual Models (p/n 22293077 & p/n 22293042) These color lipstick cameras are positioned at the factory to view the needle tip/substrate interface as material is being dispensed