New SMT Equipment: sis (583)

Triconex 2551	triconex 3721

Triconex 2551 triconex 3721

New Equipment | Industrial Automation

Contact us immediately, you can get a better price Email: sales6@cambia.cn Mobile: +86 18030270289(Whatsapp/wechat/skype)   Triconex SIS gives superior protection for people, production and profits EcoStruxure Triconex Safety Systems are an inte

Cambia Automation Limited

Triconex 2700	plc tmr

Triconex 2700 plc tmr

New Equipment | Industrial Automation

Contact us immediately, you can get a better price Email: sales6@cambia.cn Mobile: +86 18030270289(Whatsapp/wechat/skype)   Triconex SIS gives superior protection for people, production and profits EcoStruxure Triconex Safety Systems are an inte

Cambia Automation Limited

Electronics Forum: sis (2)

Electrolytic solder

Electronics Forum | Tue Mar 20 09:31:56 EST 2001 | PeteC

I dunno.: e�lec�tro�lyt�ic Of or relating to electrolysis. Produced by electrolysis. Of or relating to electrolytes. e�lec�trol�y�sis Chemical change, especially decomposition, produced in an electrolyte by an electric current. Destruction

SiPlace HS50

Electronics Forum | Wed Jan 27 10:03:39 EST 2016 | mjscottinnc

Through trail and error we figured that out the Ethernet connections from the MC to SC. We have gotten past the Software booting wait and are now waiting to connect to Siplace Pro. The machine came with no documentation other then what the service te

Industry News: sis (5)

SisTech Manufacturing, Inc. Installs Europlacer’s iineo-II SMT Platform

Industry News | 2010-09-26 15:07:04.0

Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that SisTech Manufacturing Inc. has installed its iineo-II SMT platform at its facility in Bend, Oregon.

EUROPLACER

SMTA Announces Partnership with MentorNet

Industry News | 2008-04-15 19:56:26.0

Minneapolis, MN�The Surface Mount Technology Association (SMTA) announced its recent partnership with MentorNet to help facilitate a growing demand for mentorship opportunities for its student members. The partnership allows members of the SMTA privileges to resources offered by MentorNet such as its one-on-one program, easy matching to SMTA members, and the r�sum� database for students.

Surface Mount Technology Association (SMTA)

Parts & Supplies: sis (4)

DEK BOOM  BOARD CLAMPS 500MM

DEK BOOM BOARD CLAMPS 500MM

Parts & Supplies | Pick and Place/Feeders

101004 TRANSISTOR BC108 NPN 101020 POWER SUPPLY – UPRATED CURRENT 101047 SQUEEGEE MATERIAL 9.5 X 9.5 85-90 101081 CONNECTOR CIRCULAR 14WAY 97-3102A 101142 FRONT SQUEEGEE CARRIAGE 101143 OUTER MTG SQUEEGEE BLOCK 101145 COVER (TXT) 101146

Qinyi Electronics Co.,Ltd

DEK BOOM 500MM BOARD CLAMPS

DEK BOOM 500MM BOARD CLAMPS

Parts & Supplies | Pick and Place/Feeders

101004 TRANSISTOR BC108 NPN 101020 POWER SUPPLY – UPRATED CURRENT 101047 SQUEEGEE MATERIAL 9.5 X 9.5 85-90 101081 CONNECTOR CIRCULAR 14WAY 97-3102A 101142 FRONT SQUEEGEE CARRIAGE 101143 OUTER MTG SQUEEGEE BLOCK 101145 COVER (TXT) 101146

Qinyi Electronics Co.,Ltd

Technical Library: sis (23)

Creating Reusable Manufacturing Tests for High-Speed I/O with Synthetic Instruments

Technical Library | 2020-07-08 20:05:59.0

There is a compelling need for functional testing of high-speed input/output signals on circuit boards ranging from 1 gigabit per second (Gbps) to several hundred Gbps. While manufacturing tests such as Automatic Optical Inspection (AOI) and In-Circuit Test (ICT) are useful in identifying catastrophic defects, most high-speed signals require more scrutiny for failure modes that arise due to high-speed conditions, such as jitter. Functional ATE is seldom fast enough to measure high-speed signals and interpret results automatically. Additionally, to measure these adverse effects it is necessary to have the tester connections very close to the unit under test (UUT) as lead wires connecting the instruments can distort the signal. The solution we describe here involves the use of a field programmable gate array (FPGA) to implement the test instrument called a synthetic instrument (SI). SIs can be designed using VHDL or Verilog descriptions and "synthesized" into an FPGA. A variety of general-purpose instruments, such as signal generators, voltmeters, waveform analyzers can thus be synthesized, but the FPGA approach need not be limited to instruments with traditional instrument equivalents. Rather, more complex and peculiar test functions that pertain to high-speed I/O applications, such as bit error rate tests, SerDes tests, even USB 3.0 (running at 5 Gbps) protocol tests can be programmed and synthesized within an FPGA. By using specific-purpose test mechanisms for high-speed I/O the test engineer can reduce test development time. The synthetic instruments as well as the tests themselves can find applications in several UUTs. In some cases, the same test can be reused without any alteration. For example, a USB 3.0 bus is ubiquitous, and a test aimed at fault detection and diagnoses can be used as part of the test of any UUT that uses this bus. Additionally, parts of the test set may be reused for testing another high-speed I/O. It is reasonable to utilize some of the test routines used in a USB 3.0 test, in the development of a USB 3.1 (running at 10 Gbps), even if the latter has substantial differences in protocol. Many of the SI developed for one protocol can be reused as is, while other SIs may need to undergo modifications before reuse. The modifications will likely take less time and effort than starting from scratch. This paper illustrates an example of high-speed I/O testing, generalizes failure modes that are likely to occur in high-speed I/O, and offers a strategy for testing them with SIs within FPGAs. This strategy offers several advantages besides reusability, including tester proximity to the UUT, test modularization, standardization approaching an ATE-agnostic test development process, overcoming physical limitations of general-purpose test instruments, and utilization of specific-purpose test instruments. Additionally, test instrument obsolescence can be overcome by upgrading to ever-faster and larger FPGAs without losing any previously developed design effort. With SIs and tests scalable and upward compatible, the test engineer need not start test development for high-speed I/O from scratch, which will substantially reduce time and effort.

A.T.E. Solutions

Manufacturers at the Crossroads: ERP or Best-of-Breed Software?

Technical Library | 2007-05-17 16:44:37.0

In the quest for quality, selecting the right Statistical Process Control (SPC) Software system doesn't boil down to a simple functional "fit-to-requirements" anymore. Once the expert domain of highly focused, independent software developers, the competitive landscape has changed dramatically with the influx of big-name ERP software providers who are aggressively promoting integrated quality modules within an all-encompassing business application framework.

Zontec, Inc.


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