Advanced contract electronics manufacturing services of printed circuit board and circuit card assemblies for high reliability aerospace and defense applications where operation and continued performance is critical.
Electronics Forum | Fri May 23 03:39:06 EDT 2003 | mantis
Hi Chris, I found this site to be very useful and explanitory while calculating the sigma level of or company. http://www.isixsigma.com/sixsigma/six_sigma.asp It has explanations on anything and everything process control related. Regards,
Electronics Forum | Fri Mar 24 09:57:59 EST 2006 | Gilligan
Here's another article on the lead-poisioning that shows the jewelry: http://www.cnn.com/2006/HEALTH/03/23/jewelry.lead.poisoning.ap/index.html Here's an interesting article for WML: http://www.interfluxusa.com/Technical/Sixsigma.htm
Heller 1800EXL Reflow Oven Features: * Computer-controlled automatic lubrication system for "hands-off" maintenance * Easy-clean flux filtration system with disposable filter: can be removed and replaced while oven is running for "pit-stop" mainten
Heller 1800EXL Reflow Oven This item is USED but should work as intended. This item came from a working environment. THIS ITEM COMES WITH WHAT YOU SEE IN THE PICTURES IF YOU DON’T SEE IT, YOU PROBABLY WON’T GET IT. as/is Year
Industry News | 2015-11-12 22:03:28.0
Heller Industries is thrilled to announce that we've partnered with the #1 Northern California Sales Representative Group - Lean-Stream!
Industry News | 2011-08-10 20:24:10.0
Kicking off an intense, two-day focus on the latest technologies, processes and best practices in electronics manufacturing, Jim Springer, vice president of quality at Phoenix International, will deliver the free opening session at IPC Midwest Conference & Exhibition in Schaumburg, Ill. His presentation, “Clearly Understanding Field Failures Leads to Interesting New Knowledge (CUFFLINK) - A Case Study,” will take place on September 21 at 8:00 am.
Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
Career Center | kanchipuram, Tamilnadu India | Engineering,Maintenance,Research and Development,Technical Support
Experiences : Solectron (Ems) India Ltd. Yalahanka New town, Bangalore, India Duration: AUG 2007 to Sep 2009 Designation: Process Technician (SMT) NOKIA India Pvt Ltd Sipcot Industrial area, Sriperambadur, Chennai, Duration: Sep 2009 to