Industry Directory: sixsigma (2)

microJoining Solutions

Industry Directory | Service Provider

microJoining Solutions utilizes the six-sigma approach to helping your company reduce manufacturing scrap related to poor joining processes.

Technical Manufacturing Corporation

Industry Directory | Manufacturer of Assembled PCBs / Assembly / Repair / Rework / Soldering / Contract Manufacturer

Advanced contract electronics manufacturing services of printed circuit board and circuit card assemblies for high reliability aerospace and defense applications where operation and continued performance is critical.

New SMT Equipment: sixsigma (1)

microJoining Consulting

New Equipment |  

Six-Sigma consulting in micro joining processes utilizing resistance and laser welding, selective soldering, and diode laser soldering.

microJoining Solutions

Electronics Forum: sixsigma (4)

SPC, PPM and DPMO

Electronics Forum | Fri May 23 03:39:06 EDT 2003 | mantis

Hi Chris, I found this site to be very useful and explanitory while calculating the sigma level of or company. http://www.isixsigma.com/sixsigma/six_sigma.asp It has explanations on anything and everything process control related. Regards,

The truth about lead-free and environment

Electronics Forum | Fri Mar 24 09:57:59 EST 2006 | Gilligan

Here's another article on the lead-poisioning that shows the jewelry: http://www.cnn.com/2006/HEALTH/03/23/jewelry.lead.poisoning.ap/index.html Here's an interesting article for WML: http://www.interfluxusa.com/Technical/Sixsigma.htm

Used SMT Equipment: sixsigma (2)

Heller 1800 EXL Relow Oven

Heller 1800 EXL Relow Oven

Used SMT Equipment | Soldering - Reflow

Heller 1800EXL Reflow Oven Features: * Computer-controlled automatic lubrication system for "hands-off" maintenance * Easy-clean flux filtration system with disposable filter: can be removed and replaced while oven is running for "pit-stop" mainten

World Equipment Source / R1 Source, Inc.

Heller 1800EXL

Heller 1800EXL

Used SMT Equipment | Soldering - Reflow

Heller 1800EXL Reflow Oven This item is USED but should work as intended. This item came from a working environment. THIS ITEM COMES WITH WHAT YOU SEE IN THE PICTURES IF YOU DON’T SEE IT, YOU PROBABLY WON’T GET IT.   as/is Year

World Equipment Source / R1 Source, Inc.

Industry News: sixsigma (30)

Lean Stream & Heller Reflow Technology to Partner in CA & NV

Industry News | 2015-11-12 22:03:28.0

Heller Industries is thrilled to announce that we've partnered with the #1 Northern California Sales Representative Group - Lean-Stream!

Heller Industries Inc.

When Field Failure is Not an Option — IPC Midwest Opening Session Reveals the Means to the End

Industry News | 2011-08-10 20:24:10.0

Kicking off an intense, two-day focus on the latest technologies, processes and best practices in electronics manufacturing, Jim Springer, vice president of quality at Phoenix International, will deliver the free opening session at IPC Midwest Conference & Exhibition in Schaumburg, Ill. His presentation, “Clearly Understanding Field Failures Leads to Interesting New Knowledge (CUFFLINK) - A Case Study,” will take place on September 21 at 8:00 am.

Association Connecting Electronics Industries (IPC)

Technical Library: sixsigma (1)

Addressing the Challenge of Head-In-Pillow Defects in Electronics Assembly

Technical Library | 2013-12-27 10:39:21.0

The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.

Indium Corporation

Career Center - Resumes: sixsigma (3)

SMT process engineer

Career Center | kanchipuram, Tamilnadu India | Engineering,Maintenance,Research and Development,Technical Support

Experiences : Solectron (Ems) India Ltd. Yalahanka New town, Bangalore, India Duration: AUG 2007 to Sep 2009   Designation:  Process Technician (SMT) NOKIA India Pvt Ltd  Sipcot Industrial area, Sriperambadur, Chennai, Duration: Sep 2009 to

JAMES R

Career Center | ELLENWOOD, Georgia USA | Production,Quality Control,Research and Development,Technical Support

SMT MACHINE OPERATION, FORKLIFT CERTIFY,  SUPERVISION OF MANUFACTURING AND PRODUCTION, QUALITY CONTROL TECH., AUDIO ENGINEER SKILLS,,SET-UP OF MUSICIAL THEMES AND PLAYS.

Express Newsletter: sixsigma (2)


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