New Equipment | Assembly Services
Parameter name / model specification / type UL330 UL445 UL530 UL535 Supply voltagePower Supply: AC220V/50/60HZ Supply pressureAir Supply: 5kgf/c㎡ PCB size (mm): 330*50~250 445*50~330 530*50~390 535*50~460 PCB direction: Left to right( opetio
YAMAHA Second-Hand YV180XG Pick and Place Machine Model YV180XG Panel size L Type: Max L380 x W330 mm ∼ Min L50 x W50 mm Panel thick 0.4 ~ 3.0 mm Mounting ±0.05 mm (0.01mm control) Mounting an
Electronics Forum | Mon Nov 14 12:10:05 EST 2005 | davef
Ceramic capacitors larger then EIA size 1812 are known to be very susceptible to thermal shock damage due to their large ceramic mass.
Electronics Forum | Mon Nov 07 16:34:55 EST 2005 | CW
If I am putting chip capacitors on a .063 FR4 board, what size package should we stay away from to avoid cracking? If I use 2 mil copper on the outside layers of a PCB, am I limited to what pitch of parts I can use? Specifically, will using 0603
Used SMT Equipment | SMT Equipment
Model :KE-1070 Pick and Place Machine Placement speed:Chips:18900CPH(0.190sec/chip) Component mount range:0603 chips ~33.5mm Station:80 Power supply:3-phase AC200~415C 3KVA Size:1500*1500*1455mm Weight:1590kg
Used SMT Equipment | SMT Equipment
Model :JX-100 Pick and Place Machine Placement speed:Chips:19300CPH(0.187sec/chip) Component mount range:0603 chips ~33.5mm Power supply:3-phase AC200~415C 1.5KVA Size:1370*1270*1440mm Weight:1000kg
Industry News | 2003-03-25 08:31:07.0
On completion of the transaction, Flairis will become a wholly-owned subsidiary of Beyonics and its shares will be delisted from Sesdaq.
Industry News | 2020-02-25 12:51:11.0
MIRTEC will exhibit at the SMTA Dallas and Houston Expo & Tech Forums. The Dallas Expo is scheduled to take place Tuesday, March 24, 2020 at the Plano Event Center in Plano, TX, and the Houston Expo will be held Thursday, March 26, 2020 at The Stafford Centre in Stafford, TX.
Parts & Supplies | Pick and Place/Feeders
KE-2060 can place a wide range of components from 0603 and ICs, to odd-form, all at a high rate of speed. 12,500CPH?chip (laser centering/effective tact) 1,850CPH: IC (vision centering/effective tact), 3,400CPH with MNVC option. One multi-nozzle
Parts & Supplies | Pick and Place/Feeders
- Two new placement head types in an evolution of the “1-head solution” to achieve high productivity: Accommodates super-small 0201 (0.25 x 0.125 mm) size components and large components - Extended detection range of components held for
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2019-08-08 10:23:51.0
High mix production is the mainstay of many electronics assembly plants. Lot sizes and board complexities vary and the boards are often mixed technology, comprising a blend of both surface mount and through-hole technology. Modularizing a production line enables a clear distinction between one type of assembly process and another. This article assumes a modern factory where a job can be routed to the selective soldering machine module, the hand assembly bench, or a combination of both. The decision rules of routing a circuit board through hand assembly versus automated selective soldering are discussed. Hand assembly soldering operations require no explanation.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | ON DEMAND | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,
Great Lakes Chapter Meeting: Flexible Wave Solder Processes and Optimization
Events Calendar | Thu Apr 15 00:00:00 EDT 2021 - Thu Apr 15 00:00:00 EDT 2021 | ,
LA/OC Chapter Meeting and Technical Presentation: Manufacturing Simulation
SMTnet Express, February 13, 2020, Subscribers: 34,017, Companies: 10,974, Users: 25,597 Size Matters - The Effects of Solder Powder Size on Solder Paste Performance Credits: FCT ASSEMBLY, INC. Solder powder size is a popular topic
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_custom-grid-size-and-layer-colour_topic1853.xml
PCB Libraries Forum : Custom GRID Size and Layer Colour PCB Libraries Forum : Custom GRID Size and Layer Colour This is an XML content feed of
KingFei SMT Tech | https://www.smtspare-parts.com/sale-37303622-panasonic-bd10s-bd12s-m-dispenser-nozzle-1608-2125-3216-nozzle.html
Panasonic BD10S BD12S-M Dispenser Nozzle 1608/2125/3216 Nozzle Leave a Message We will call you back soon! Your message must be between 20-3,000 characters