Electronics Forum: sm-785 (Page 1 of 3)

Temperature cycling

Electronics Forum | Tue Apr 09 08:27:55 EDT 2002 | davef

Read SM-785 - "Guidelines For Accelerated Reliability Testing Of SM Solder Attachments"

BGA Thermal Cycling Tests?

Electronics Forum | Wed Nov 19 22:39:10 EST 2003 | davef

SM-785 - Guidelines For Accelerated Reliability Testing Of SM Solder Attachments

BGA Reliability Testing

Electronics Forum | Thu Mar 10 22:56:33 EST 2005 | davef

SM-785 - Guidelines For Accelerated Reliability Testing Of SM Solder Attachments

Temperature testing

Electronics Forum | Wed Jul 20 07:11:34 EDT 2005 | davef

SM-785 - Guidelines For Accelerated Reliability Testing Of SM Solder Attachments What is the goal of this temperature testing?

Environmental Testing

Electronics Forum | Mon Oct 03 10:44:30 EDT 2005 | davef

SM-785 - Guidelines For Accelerated Reliability Testing Of SM Solder Attachments

BGA Solder Acceptance Criteria

Electronics Forum | Thu Aug 31 07:42:25 EDT 2006 | davef

IPC-SM-785 - Guidelines For Accelerated Reliability Testing Of SM Solder Attachments

BGA PCB Pad size

Electronics Forum | Mon Jan 27 09:43:15 EST 2003 | davef

Sorry. I mistyped information on the guidelines. It should be: SM-785 - Guidelines For Accelerated Reliability Testing Of SM Solder Attachments Order SM-785 from: IPC 2215 Sanders Rd Northbrook, IL 60062-6135 847-509-9700 When you are ordering t

SMT layout for multiple packages

Electronics Forum | Fri Apr 27 11:26:53 EDT 2001 | pteerink

Check out IPC SM-785 Land pattern guidelines for SMT www.ipc.org Phil

Soak Test

Electronics Forum | Tue Sep 20 11:41:17 EDT 2005 | davef

We don't know how to accelerate soak recipes. We'd suggest that you use the recipe for your product use environment that is suggested in SM-785 - Guidelines For Accelerated Reliability Testing Of SM Solder Attachments

PCBA shelf life

Electronics Forum | Mon Jan 05 18:03:04 EST 2004 | davef

You may struggle finding the information that you seek, because there is so much variability in the design and fabrication of boards. * What is the purpose of such a test? * What product type sees such an use environment? Consider using the guidelin

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