Industry Directory | Repair / Rework / Soldering / Test Services / Distributor / Service Provider
Repair, refurbishing and re-sale of gadgets and electronic equipment such as Smartphones, PC, Mac, Xbox, PlayStation and Nintendo Wii.
Industry Directory | Manufacturer of Assembled PCBs / Design / Turnkey / Contract Manufacturer / OEM
Kaifa provides a full turnkey manufacturing service includes Research and Development, Production, and Distribution for its worldwide ODM and OEM customers.
Scalable Fluid Dispensers for Assembly of Semiconductors, MEMS, Storage Devices, and PCBs. High Speed, High Accuracy, Precision Dispensing System. The Spectrum II Series is the next evolution of the widely successful Spectrum fluid dispensers from
Innovation, performance and flexibility driven specifically toward the needs of the Automotive, Smartphone and Semiconductor markets. The Camalot® Prodigy™ dispensing system employs breakthrough technology innovations to enable higher proc
Electronics Forum | Thu Apr 30 02:09:50 EDT 2020 | bukas
Thank you for you reply yernie. This forum is about industrial electronics assembly machines and technologies and not about smartphones. btw, the problem was IF board if anyone was wondering.
Electronics Forum | Wed Feb 01 18:56:08 EST 2017 | dleventhal
Heller would be the choice here as they have over 1000 ovens installed around the world doing smartphone soldering. Something like 8 million phones a week are processed on Heller ovens at all the large phone manufactures. You can trust that they h
Used SMT Equipment | SMT Equipment
Auction: Phoenix X-Ray PCB Analyser, Wafer Probers, Test Chambers, Hot Bar Bonders, Dicing Saws & More Featuring: BAE - Manassas, Virginia USA • V.J. Technologies VJ-1000 X-Ray System A World Class Semiconductor Mfg. Co. - Hayward, California USA
Used SMT Equipment | AOI / Automated Optical Inspection
YAMAHA AOI YSi-V MACHINE KLT-000 1. Model: Yamaha ysi-v 2. Target substrate: l610 x w560 (maximum) ~ l50 x w50 (minimum) & supports l750mm super long substrate (optional) 3. Resolution: visible light (red/green/blue) & infrared (infra-
Industry News | 2015-01-21 21:05:20.0
MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #2333 at the 2015 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 24–26, 2015 at the San Diego Convention Center.
Industry News | 2012-01-10 19:07:22.0
SMTA and Chip Scale Review magazine are pleased to announce the keynote presentation for IWLPC 2012 in San Jose, CA. John Ellis will detail the very possible threat of Cyber-Physical Terrorism in his presentation, "A Trojan Chip in Your Smartphone? It's Coming..."
Technical Library | 2020-10-18 19:31:27.0
Embedded components technology has launched its implementation in volume products demanding high levels of miniaturization. Small modules with embedded dies and passive components on the top side are mounted in hand held devices. Smartphones have been the enablers for this new technology using the capabilities of embedded components. With this technological background another business field became interesting for embedded components – the embedded power electronics. The roadmap of the automotive industry shows a clear demand for miniaturized power electronic applications. Drivers are the regulations for the international fleet emissions which are focusing on three major trends.
AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
Technical Library | 2018-08-15 17:27:28.0
Smartphones and tablets require very high flexibility and severe bending performance ability of the flexible printed circuits (FPCs) to fit into their thinner and smaller body designs. In these FPCs, the extraordinary highly flexible, treated rolled-annealed (RA) copper foils have recently used instead of regular RA foil and electro deposited foils. It is very important to measure the Young's moduli of these foils predicting the mechanical properties of FPCs such as capabilities of fatigue endurance, folding, and so on. Even though the manufacturers use IPC TM-650 2.4.18.3 test method for measuring Young's modulus of copper foils over many years, where Young's modulus is calculated from the stress–strain (S–S) curve, it is quite difficult to obtain the accurate Young's modulus of metal foils by this test method.
With the Spectrum II's new Precision Z-axis, smaller dots and thinner solder paste lines can be achieved. This capability is standard on all Spectrum II systems and replaces the Precision Z option on the older Axiom products. In order to achieve su
Career Center | Poway, California USA | Engineering,Production
Technically qualified in proper operation, troubleshooting, installation /dismantling, programming and preventive maintenance of SMT (Surface Mount Technology) machines. Productivity and quality for the production of PCBA (Printed Circuit Board Ass
Nippon Mining & Metals Smartphones and tablets requi
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/improve-uph-and-quality-with-automatic-dual-simultaneous-dispensing
. This ongoing innovation continues to drive consumer demand which in turn requires smartphone manufacturers to continually focus on UPH, quality, and dense component assembly improvement opportunities
| https://productronica.com/de/messe/auf-der-messe/app/
. Die productronica App – Vier Tage Messe in Ihrer Hand Mit der Smartphone-App der productronica haben Sie stets alle gewünschten Informationen umgehend zur Hand. Die App steht für beide
