Industry Directory | Manufacturer
OMG is the manufacturer of the Microbond line of solder pastes, fluxes and solder spheres.
New Equipment | Solder Materials
I.C.T | Antioxidant Silver Soldering Tin Lead Free Solder Bar for Solder Wave ❙ Introduction I.C.T has been working with suppliers to develop environmentally friendly lead-free solders and related materials and can now supply products that delive
New Equipment | Solder Materials
We offer Lead Free Solder Wire and Halogen Free Solder Wire; OEM service is available. Alloy / FLUX F4 F10 Sn/Cu v v Sn/Ag v v
Electronics Forum | Thu Jun 21 00:23:55 EDT 2001 | Robert Sykoh
Hi, I am looking into lead free process. Do anybody has experience?? The composition used in SMT & wave. I heard Sn,Ag,Cu & Sn,Ag,Cu,Bi. What are the major differences and concerns. Besides, what are the capital investment required?? Any advice is
Electronics Forum | Mon Feb 07 15:53:12 EST 2005 | John S
I ran across a description of a SnAgCuIn variant of lead free solder that melts around 195C. Has anyone used such an alloy? Is it widely available? I haven't seen it marketed widely. Thanks John S
Used SMT Equipment | Soldering Equipment/Fluxes
Solder Wave by SEHO, in good condition. SEHO GoWave 1030 product information. Usable soldering width max. 340 mm [13.39”] Pass-through height (measured from bottom edge of PCB) 100 mm [3.94”] PCB / solder mask dimensions l x w max. 410 x 340 m
Used SMT Equipment | Soldering Equipment/Fluxes
Solder Wave by SEHO, in good condition. SEHO GoWave 1030 product information. Usable soldering width max. 340 mm [13.39”] Pass-through height (measured from bottom edge of PCB) 100 mm [3.94”] PCB / solder mask dimensions l x w max. 410 x 340 m
Industry News | 2018-04-09 19:48:04.0
SMTA Europe announces Session 1 Technical Program on Predicting Component Life at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2022-10-24 08:01:58.0
I.C.T has been working with suppliers to develop environmentally friendly lead-free solders and related materials and can now supply products that deliver high reliability. We also stand ready to work with customers in developing improved soldering materials and processes.Our objective is maximizing customer satisfaction by achieving the best possible quality and yield.
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2008-11-20 00:46:10.0
The Sn/Ag/Cu family of alloys is the leading candidate for a lead-free alternative. The first part of this study was to determine if there is any significant difference between Sn/Ag/Cu alloys when used in automatic soldering equipment in terms of copper build-up in the system. The study compared two Sn/Ag/Cu alloys to determine if at processing temperatures one alloy would absorb less copper than the other alloy.
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SnAgCuBi and SnAgCuBiSb solder joint properties investigations SnAgCuBi and SnAgCuBiSb solder joint properties investigations This study investigates the technological properties of quaternary or quinary alloys made by addition Bi or Bi and Sb
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. Sn-AG-Cu solder, which is eutectic at 3.9% Ag and 0.6% Cu, exhibits a melting temperature of about 217 deg C. Copper may be difficult to stabilize in this alloy. Nickel-Palladium
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
-Pb alloy. There are a handful of alternative Pb-free alloys available on the market today, which are variations of Sn-Ag-Cu or Sn-Cu based alloys which have varying degrees of elemental additives such as nickel (Ni), germanium (Ge), bismuth (Bi
