New SMT Equipment: sn99 ag0.3 cu0.7 (13)

solder paste Sn63/Pb37

solder paste Sn63/Pb37

New Equipment | Solder Materials

http://www.flason-smt.com/product/solder-paste-Sn63-Pb37.html solder paste Sn63/Pb37 solder paste Sn63/Pb37 Tin solder paste Sn63/Pb37 Tin solder paste Sn63/Pb37 Product description: solder paste Sn63/Pb37  INQUIRY Solder paste Sn63/Pb

Flason Electronic Co.,limited

100g Solder Paste for BGA refwork mobile phone repare

100g Solder Paste for BGA refwork mobile phone repare

New Equipment | Solder Materials

http://www.flason-smt.com/product/100g-Solder-Paste-for-BGA-refwork-mobile-phone-repare.html 100g Solder Paste for BGA refwork mobile phone repare 100g Solder Paste BGA refwork Solder Paste mobile phone repare Solder Paste 100g Solder Paste fo

Flason Electronic Co.,limited

Electronics Forum: sn99 ag0.3 cu0.7 (15)

Lead Free Solder Sn(99%)/Ag(0.3%)/Cu(0.7%)

Electronics Forum | Mon Apr 30 06:44:34 EDT 2007 | dszeto

Is there any benchmarking / report available on the industry regarding to the application of leadfree solder Sn(99%)/Ag(0.3%)/Cu(0.7%) e.g. Alpha Metals SACX0307 compared to SAC305? Thanks! Daniel

Lead Free Solder Sn(99%)/Ag(0.3%)/Cu(0.7%)

Electronics Forum | Wed May 02 02:41:30 EDT 2007 | May

Of course it is needless to say the performance of SACX0307 is worse than SAC305, and also to some other lead free solders,eg SN100C & SCS7.

Used SMT Equipment: sn99 ag0.3 cu0.7 (1)

Ersa Ecoselect 350

Ersa Ecoselect 350

Used SMT Equipment | Soldering Equipment/Fluxes

The following Ersa Ecoselect 350 is a lead free selective solder system with various spares. It is included in the Manroland Online Auction scheduled for August 27-28 on www.xlineassets.com. This system will be sold to the highest bidder and is curre

X-Line Asset Management

Industry News: sn99 ag0.3 cu0.7 (2)

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Industry News | 2018-10-18 08:59:34.0

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Flason Electronic Co.,limited

Lead-Free (Pb-Free) Solder and Composition

Industry News | 2018-12-08 03:38:44.0

Lead-Free (Pb-Free) Solder and Composition

Flason Electronic Co.,limited

Technical Library: sn99 ag0.3 cu0.7 (1)

Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates

Technical Library | 2021-09-08 13:43:56.0

Manganese can be an optimal alloying addition in lead-free SAC (SnAgCu) solder alloys because of its low price and harmless nature. In this research, the mechanical properties of the novel SAC0307 (Sn/Ag0.3/Cu0.7) alloyed with 0.7 wt.% Mn (designated as SAC0307-Mn07) and those of the traditionally used SAC305 (Sn96.5/Ag3/Cu0.5) solder alloys were investigated by analyzing the shear force and Vickers hardness of reflowed solder balls. During the preparation of the reflowed solder balls, different cooling rates were used in the range from 2.7 K/s to 14.7 K/s.

Budapest University of Technology and Economics

Express Newsletter: sn99 ag0.3 cu0.7 (1)


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