BGA Rework Services Offered BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
Compact designed machines to match perfectly different kind of modular operation process Key configuration : Tray in - Tray out Tray in - Tape out Tape in - Tape out Tube in - Tape out Tube in - Tube out Bowl input Bulk output Popular cus
Electronics Forum | Wed Oct 07 17:36:48 EDT 1998 | Ted Nicholas
Hello! Does any one know of a disadvantage of using the Phillips recommended wave solder SOIC footprint where the last pad on each side of the SOIC is enlarged, instead of placing an extra pair of pads behind the SOIC. Both footprint patterns seem e
Electronics Forum | Tue Oct 26 03:12:36 EDT 2004 | Joseph
Dear all, Recently our production encountered high SOIC failure during testing after reflow soldering. All solder fillets (side/heel) are acceptable as per IPC standard.The reject samples (SOIC)being sent to IC manufacturer to verify the failure. Fin
Optimal placement rate: 14,000 cph Simultaneous pick Nominal placement rate: 9,000 - 11,000 cph Component Ranges: 0402 - SOP, SOJ, PLCC, QFP 25 X 25 mm QFP 21 mm (0.83") with pin pitch down to 0.65 mm (25 mil) Line sensor camera system QFP 32 mm (1.
The Emerald-X is a fine pitch placer that can handle a wide range of components at speeds up to 4,000 QFPs per hour. The machine is built around a very rigid, vibration-free frame for improved accuracy and long-term stability and is perfectly suit
Industry News | 2013-01-14 08:41:05.0
OK International will debut the new Metcal MX-5200 Soldering, Desoldering and Rework Series in Booth #735 at the upcoming IPC APEX EXPO
Industry News | 2013-02-27 15:04:56.0
February 2013 ― OK International will demonstrate the new Metcal MX-5200 Soldering, Desoldering and Rework Series in Booth E22 at the Enova Grand Ouest exhibition, scheduled to take place March 27-28, 2013 in Rennes, France.
DEK CARRIER^BOARD CLAMP 158815 158815 CARRIER BOARD CLAMP TRANSPORT RAILS 500 ..03128595 2010 Y Cable Carrier E2057729000 2020L X axis cable carrier 40008068 2030E YR cable carrier E2169729000 2030E YR cable carrier link E2170
SMT basic process components include: silk screen (or dispensing), placement (curing), reflow soldering, cleaning, testing, repair 1, silk screen: its role is to paste or patch solder paste printed on the PCB pad, the components f
LISA SPIDER robot pick and place machine 2D/3D vision components copanarity check Tape & reel for tape OUT process Tray stacker for Tray IN proce/OUT process Tape IN feeder Anyfeeder for loose component sorting More under www.aatec.ch
The IPC-7711 & 7721 Instructor course is built on a train-the-trainer model. Upon completion of the course, students will know the technical guidelines of IPC-7711 and 7721 and have demonstrated the proficiency necessary to perform rework and repair
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Training Courses | | | IPC-7711/7721 Trainer (CIT) Recert.
The Certified IPC-7711/7721 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC-7711/7721 Trainer (CIS) training.
. View all Products for Microelectronics Plastic Encapsulated Microcircuits PBGAs PLCCs, PQFPs, TSOPs, SOICs, TQFPs J-STD-020, J-STD-035 NASA
) Comtra Assembleon Slope Feeders Model EF80P8 Category: 164 Roison Tech Assembleon Slope Feeders Model EF80P1 SOIC8-16 Sold at Intervala on 5/4/2022 Mason OH Previous Item Next Item Lot Number: 164 Description