Electronics Forum | Thu Apr 05 03:19:04 EDT 2018 | myke03o
We are currently in a Clean solder process (SMT+Wave Solder+Washing). Now our management is planning to convert to a No-Clean process in SMT due to limitations of solder availability and reduction of washing process. Question1: Is it possible to was
Electronics Forum | Mon Apr 09 11:34:59 EDT 2018 | emeto
definitely don't mix clean and No clean. Run No Clean as you decided, but have your flux and paste manufacturers advice, how this flux can be cleaned(if you decide or required to clean). I know for a fact that some of these NC flux residues are almos
Electronics Forum | Thu Apr 05 17:06:11 EDT 2018 | stephendo
We recently got a batch wash machine that can use a chemical cleaner. (not a saponifier). NOW I feel confident cleaning no clean boards. Without a machine that can heat water and use a proper cleaning agent, I would not trust cleaning no clean boards
Electronics Forum | Fri Apr 06 12:31:07 EDT 2018 | deanm
Your fluxes are required to be compatible per J-STD-001. I wouldn't even attempt mixing no-clean (rosin) and clean (assuming water soluble) fluxes on the same assembly, especially if the fluxes are from two different vendors. If your paste and liquid
Electronics Forum | Tue Aug 16 07:51:16 EDT 2011 | a
C-SAM is a non-destructive alternative that a lot laboratories and chip manufacturers use. Dye and Pry would work I suppose although I have never done it in practice with PoP but it should be any different for PoP.
Electronics Forum | Wed Mar 12 16:20:51 EDT 2008 | hussman
Poor training. Don't blame the operator, he was either shown this or left to his own devices. Be the better man and provide him a better process. Regular old peelabale solder mask would be a start.
Electronics Forum | Wed Mar 12 12:28:52 EDT 2008 | operator
I recently witnessed a process in which the solder pot operator used Techspray WSOL water soluble masking to cover the areas around a connector that was to be soldered on the solder pot. He did not wait for the WSOL to cure. He soldered immediately.
Electronics Forum | Thu Nov 01 10:57:34 EDT 2012 | kris1128
Has anyone heard whether the elevation of a plant can effect solder joint formation? One plant at sea level, one at 7,000 feet elevation... same equipment and profiles, big voiding defects at higher elevation. I did a search and found no similar post
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
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