Industry News: solder and balling (Page 1 of 182)

HELLER Participates at the Beijing Intelligent Manufacturing and SMT Technology Exchange Conference

Industry News | 2023-06-12 21:14:11.0

The 2023 Beijing Intelligent Manufacturing and SMT Technology Exchange Conference, hosted by the Intelligent Manufacturing Committee of the Beijing Electronics Society, was successfully held in Beijing on May 25th. HELLER was honored to be invited and actively participated by sharing their cutting-edge technology and expertise.

Heller Industries Inc.

Heller Industries Opens New Office and Demo Center in Taoyuan, Taiwan

Industry News | 2023-03-30 22:45:02.0

Taoyuan, Taiwan (February 27, 2023) – Heller Industries, a leading provider of reflow and curing ovens for SMT and semiconductor advanced packaging, today announced the opening of a new office in Taoyuan, Taiwan, to meet the growing demand for reflow and curing equipment in the Taiwan region.

Heller Industries Inc.

Pac Tech USA Offering Contract Wafer Bumping, Stencil Services

Industry News | 2003-01-27 10:27:31.0

At a New Facility Within the Company's U.S. Headquarters

SMTnet

MIRTEC to Preview the MP-520 Advanced System in Package (SiP) Inspection and Measurement System at SEMICON West 2015

Industry News | 2015-06-11 16:02:18.0

MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.

MIRTEC Corp

Water-Based Flux Line Covers Full Range of Applications

Industry News | 2003-02-17 08:40:25.0

To Meet Government Environmental Standards and Individual Company Policies, While Satisfying Production Requirements

SMTnet

MIRTEC to Exhibit Extensive Range of AOI, SPI, X-ray and Specialized LED Inspection Systems at IPC APEX 2012

Industry News | 2012-01-23 00:02:12.0

MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI, X-ray and LED inspection systems at the IPC APEX Expo in booth #3637.

MIRTEC Corp

Investment Boosts SMT Placement and Rework

Industry News | 2003-06-04 09:19:23.0

With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.

SMTnet

MIRTEC to Introduce MV-9 SIP and MP-7 MICRO at SEMICON West

Industry News | 2014-06-22 19:12:37.0

MIRTEC, “The Global Leader in Inspection Technology,” will exhibit in Booth #5444-1 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA.

MIRTEC Corp

MIRTEC to Premier Its AOI Series at APEX 2008

Industry News | 2008-02-28 21:48:17.0

OXFORD, CT � February 2008 � MIRTEC a leading global supplier of AOI systems to the electronics manufacturing industry, announces that it will introduce its MV series of AOI systems in booth 1857 at the upcoming APEX exhibition & conference scheduled to take place April 1-3, 2008 in Las Vegas.

MIRTEC Corp

Don’t Miss MIRTEC and Southwest Systems at the SMTA Dallas and Houston Expos

Industry News | 2020-02-25 12:51:11.0

MIRTEC will exhibit at the SMTA Dallas and Houston Expo & Tech Forums. The Dallas Expo is scheduled to take place Tuesday, March 24, 2020 at the Plano Event Center in Plano, TX, and the Houston Expo will be held Thursday, March 26, 2020 at The Stafford Centre in Stafford, TX.

MIRTEC Corp

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