Electronics Forum | Tue Nov 28 20:12:41 EST 2006 | davef
We don't have a gap between the lead and the pad after a SM joint is soldered. On our boards, this space is filled with the solder intended to attach the component to the board. How high do components sit above the surface of a board? Most people a
Electronics Forum | Wed Nov 29 10:10:50 EST 2006 | M. Sanders
I'm sorry, Dave - I didn't make myself very clear. Yes, this space (not really a "gap") is filled with solid solder. For instance, if you place a gull-wing component in solder paste, after reflow, there will probably be a thin film of solidied solder
Industry News | 2015-06-11 16:02:18.0
MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.
Industry News | 2010-09-30 00:35:51.0
The new E revisions of IPC’s popular desk reference manuals, IPC-DRM-PTH, Through-Hole Solder Joint Evaluation Training & Reference Guide and IPC-DRM-SMT, Surface Mount Solder Joint Evaluation Training & Reference Guide have been released.
Teresa Rowe, IPC director of assembly standards, highlights several revisions to IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610F, Acceptability of Electronic Assemblies. The documents have been updated to
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development tr
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