New Equipment | Education/Training
Solder Training and Solder Certification Courses Taught in Accordance With IPC Soldering Guidelines. We offer a variety of customized courses set up specifically for our customers requirements. An example would be our combination type certificate t
ACI Technologies employs personnel that are Master IPC Trainers and Certified IPC Trainers for all IPC inspection standards. Visual Inspection Services ACI Technologies employs personnel that are Master IPC Trainers and Certified IPC Trainers for a
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Ball Grid Array X-Ray Inspection Guide - 20 Colour Charts Includes X-Ray inspection guide of satisfactory BGA solder joints and process defects, x-ray images are black and white. The posters are provided as a pdf file and can be printed as A4 or A3
New Equipment | Soldering Robots
C-Turn Desktop System for ACF Final/Heat Seal Bonding, Hot Bar Reflow Soldering and Heat Staking, handles the product in pneumatic turning unit with a diameter of 410 mm, with a fixture size up to 160 x 160 mm. The Nordson DIMA Desktop Series is a p
New Equipment | Soldering Robots
C-Prime Desktop System for ACF Final/Heat Seal Bonding, Hot Bar Reflow Soldering and Heat Staking, handles the product in a fixed position, with an optional fixture, size up to 300 x 200 mm. The Nordson DIMA Desktop Series is a product range for ACF
New Equipment | Soldering Robots
C-Slide Desktop System for ACF Final/Heat Seal Bonding, Hot Bar Reflow Soldering and Heat Staking, handles the product in a pneumatic slide of two or three positions (max. 150 mm stroke), with a fixture size up to 250 x 250 mm. The Nordson DIMA Desk
New Equipment | Soldering Robots
The C-Base Bonding/Soldering system is a combination of a C-Flow and a C-Drive module and stands alone from other pulsed heat controllers with its unique integration of responsive temperature control and useful tools such as displacement monitoring a
The TR7700QE-S is built on a high precision platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry. The Stop-and-Go 3D AOI is able to inspect wire bonds, die bonds, SMD, bumps, and solder joints. The
The 2K Series is an inspection and process control solution enabling a 100% defect detection including presence, absence, polarity, placement accuracy, OCV as well as lifted lead inspection and sensitive solder joints & bridges. The 2K Series improve
