Industry News: solder and paste (Page 1 of 406)

HELLER Participates at the Beijing Intelligent Manufacturing and SMT Technology Exchange Conference

Industry News | 2023-06-12 21:14:11.0

The 2023 Beijing Intelligent Manufacturing and SMT Technology Exchange Conference, hosted by the Intelligent Manufacturing Committee of the Beijing Electronics Society, was successfully held in Beijing on May 25th. HELLER was honored to be invited and actively participated by sharing their cutting-edge technology and expertise.

Heller Industries Inc.

Heller Industries Opens New Office and Demo Center in Taoyuan, Taiwan

Industry News | 2023-03-30 22:45:02.0

Taoyuan, Taiwan (February 27, 2023) – Heller Industries, a leading provider of reflow and curing ovens for SMT and semiconductor advanced packaging, today announced the opening of a new office in Taoyuan, Taiwan, to meet the growing demand for reflow and curing equipment in the Taiwan region.

Heller Industries Inc.

Frost & Sullivan Award Highlights Heller Industries' Achievements in Global SMT Reflow Soldering Equipment Market

Industry News | 2013-05-21 22:12:09.0

Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.

Heller Industries Inc.

Henkel Names New Global Sales Director for Semiconductor Materials

Industry News | 2009-02-02 18:48:47.0

Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.

Heller Industries Inc.

HELLER'S High UPH Vacuum Oven Wins the "17th Step-by-Step Excellence Awards"

Industry News | 2023-10-18 17:43:18.0

HELLER's High UPH Vacuum Reflow Oven clinched the coveted "Step-by-Step Excellence Awards" - Innovation Award owing to its industry-leading product strength and outstanding performance.

Heller Industries Inc.

Latest Dispense Technology for Integration and Retrofit

Industry News | 2017-10-02 13:58:42.0

GPD Global will exhibit at the upcoming IMAPS 2017. At booth 244, GPD Global will exhibit a complete line of Fluid Dispensing pumps with the latest dispense technologies for integration or retrofit. Whether your process requires low or high viscosity fluids, thick pastes, or abrasive media, there is a dispense pump to meet your requirements.

GPD Global

GPD Global Pushes the Limits for Small Volume Dispensing The new Nano-Piston Pump is now available

Industry News | 2013-10-10 09:56:45.0

GPD Global has again pushed the limits for small-volume dispensing with its new Nano-Piston pump. Dots of conductive adhesive down to 100 μm and solder paste for 01005s are possible with the Nano-Piston Pump.

GPD Global

New Dispensing & Conformal Coating Products - Live Demo - Booth 2933, APEX San Diego

Industry News | 2017-01-26 19:53:00.0

GPD Global will exhibit in Booth 2933 at the upcoming IPC APEX EXPO 2017 scheduled to take place February14-16, San Diego Convention Center. GPD Global will officially launch its new, fully automated dispense platform, Hyperion, and a new, low cost conformal coating system.

GPD Global

GPD Global to Roll Out FPC Dispense Platform at Productronica

Industry News | 2013-10-09 10:29:04.0

GPD Global will exhibit in Stand 214 in Hall A4 at the Productronica International Trade Fair. On display will be the versatile Max Series platform for dispensing of SMT glue, solder paste, conductive adhesives, underfill, UV, LED and more, configured with the volumetric PCD4H dispense pump and shown for the first time will be the NCM5000 simplified jetting pump.

GPD Global

  1 2 3 4 5 6 7 8 9 10 Next

solder and paste searches for Companies, Equipment, Machines, Suppliers & Information