http://www.flason-smt.com/product/SMD-Pick-and-Place-Machine.html SMD Pick and Place Machine Applicable Components: Board size:330×250mm Feeder inputs:20 placement capacity: 22,500CPH Product description: SMD Pick and Place Machine FUJI
FUJI NXT SMD Pick and Place Machine Applicable Components: Board size:330×250mm Feeder inputs:20 placement capacity: 22,500CPH Product description: FUJI NXT SMD Pick and Place Machine FUJI NXT SMD Pick and Place Machine Product Featur
Electronics Forum | Thu Aug 31 18:59:55 EDT 2000 | Brian W.
Our customers use OSP, HASL, immersion tin and immersion gold as board finishes. If I recommend a finish to the customer, it is one of the immersion finishes or OSP. Those finishes have the advantage of a flat surface to deposit paste. HASL has va
Electronics Forum | Thu Sep 26 11:44:23 EDT 2002 | abelardo
Hello everyone out there in the SMT world. I have a dilema I'm currently running a board that has 3 csp's with a .75 mm. ball pitch and .3mm ball size. And 2 qfp's-160. The stencil is 4 mils thick and I'm using a 63/37 solder paste. My reflow prof
Industry News | 2014-09-09 21:35:30.0
FCT Assembly today announced plans to exhibit in Booth # I105 at OctoberBest 2014, scheduled to take place Wednesday, October 1, 2014 at Tektronix in Beaverton, OR.
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RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ
Technical Library | 2019-06-07 14:49:54.0
ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins.
SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk
aluminum or gold wire. Gold wire provides the abilit
+125oC for 5800 cycles. It was observed that ENIG surface finish improves the component reliability comparing to OSP and ImAg. It is also observed that matching solder sphere with solder paste alloys improves the reliability in several cases, but a significant improvement was not observed when compared with the SAC305 solder spheres
. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints