New SMT Equipment: solder and paste and issues and gold and padas (6)

SMD Pick and Place Machine

SMD Pick and Place Machine

New Equipment | Pick & Place

http://www.flason-smt.com/product/SMD-Pick-and-Place-Machine.html SMD Pick and Place Machine Applicable Components: Board size:330×250mm Feeder inputs:20 placement capacity: 22,500CPH Product description: SMD Pick and Place Machine FUJI

Flason Electronic Co.,limited

FUJI NXT SMD Pick and Place Machine

FUJI NXT SMD Pick and Place Machine

New Equipment | Pick & Place

FUJI NXT SMD Pick and Place Machine Applicable Components: Board size:330×250mm Feeder inputs:20 placement capacity: 22,500CPH Product description: FUJI NXT SMD Pick and Place Machine FUJI NXT SMD Pick and Place Machine Product Featur

Flasonsmt Co.,ltd

Electronics Forum: solder and paste and issues and gold and padas (2)

Re: CuOSP and IMM Silver versus HASL

Electronics Forum | Thu Aug 31 18:59:55 EDT 2000 | Brian W.

Our customers use OSP, HASL, immersion tin and immersion gold as board finishes. If I recommend a finish to the customer, it is one of the immersion finishes or OSP. Those finishes have the advantage of a flat surface to deposit paste. HASL has va

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Thu Sep 26 11:44:23 EDT 2002 | abelardo

Hello everyone out there in the SMT world. I have a dilema I'm currently running a board that has 3 csp's with a .75 mm. ball pitch and .3mm ball size. And 2 qfp's-160. The stencil is 4 mils thick and I'm using a 63/37 solder paste. My reflow prof

Industry News: solder and paste and issues and gold and padas (4)

FCT Assembly to Exhibit Innovative Pastes and Stencils at OctoberBest

Industry News | 2014-09-09 21:35:30.0

FCT Assembly today announced plans to exhibit in Booth # I105 at OctoberBest 2014, scheduled to take place Wednesday, October 1, 2014 at Tektronix in Beaverton, OR.

FCT ASSEMBLY, INC.

RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ

Industry News | 2018-12-08 03:24:24.0

RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ

Flason Electronic Co.,limited

Technical Library: solder and paste and issues and gold and padas (1)

Surface Finish Issues Affecting Solderability and Reliability

Technical Library | 2019-06-07 14:49:54.0

ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins.

ACI Technologies, Inc.

Express Newsletter: solder and paste and issues and gold and padas (1116)

SMTnet Express - August 7, 2014

SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk

SMTnet Express - July 24, 2014

aluminum or gold wire. Gold wire provides the abilit

Partner Websites: solder and paste and issues and gold and padas (87)

Webinars and Webtorials

Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm

+125oC for 5800 cycles. It was observed that ENIG surface finish improves the component reliability comparing to OSP and ImAg. It is also observed that matching solder sphere with solder paste alloys improves the reliability in several cases, but a significant improvement was not observed when compared with the SAC305 solder spheres

Surface Mount Technology Association (SMTA)

The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf

. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints

Heller 公司


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