Partner Websites: solder and paste and issues and gold and padas (Page 1 of 9)

Solder Paste Shelf Life and Testing - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/soldertips/soldertip/solder-paste-shelf-life-and-testing

.   More SolderTips Solder Pot Maintenance and Dross Removal What’s with the expiration dates on solder paste or wire? Accept or Reject: Solder Contacting Component Bodies Issues of Burnt Flux on Class 3 PCB Assemblies Gold Removal Issues with Hollow Cup Connectors Have a question about training or IPC certification

Solder Pot Maintenance and Dross Removal | EPTAC

| https://www.eptac.com/soldertips/solder-pot-maintenance-and-dross-removal/

: Solder Contacting Component Bodies Issues of Burnt Flux on Class 3 PCB Assemblies Gold Removal Issues with Hollow Cup Connectors Acceptability of Conformal Coating Bubbles Search Looking for Training Products? SolderTraining.com can help

SolderTips: Gold Removal and Wave Soldering vs Hand Soldering | EPTAC

| https://www.eptac.com/soldertips/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/

. Recent Posts Solder Pot Maintenance and Dross Removal What’s with the expiration dates on solder paste or wire? Accept or Reject: Solder Contacting Component Bodies Issues of Burnt Flux on Class 3 PCB Assemblies Gold Removal Issues with Hollow Cup Connectors Acceptability of Conformal Coating Bubbles Search Looking for Training Products? SolderTraining.com can help

Webinars and Webtorials

Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm

+125oC for 5800 cycles. It was observed that ENIG surface finish improves the component reliability comparing to OSP and ImAg. It is also observed that matching solder sphere with solder paste alloys improves the reliability in several cases, but a significant improvement was not observed when compared with the SAC305 solder spheres

Surface Mount Technology Association (SMTA)

Gold Removal Issues with Hollow Cup Connectors | EPTAC

| https://www.eptac.com/soldertips/gold-removal-issues-with-hollow-cup-connectors/

. Recent Posts Solder Pot Maintenance and Dross Removal What’s with the expiration dates on solder paste or wire? Accept or Reject: Solder Contacting Component Bodies Issues of Burnt Flux on Class 3 PCB Assemblies Acceptability of Conformal Coating Bubbles Search Looking for Training Products? SolderTraining.com can help

Solder Pot Maintenance and Dross Removal - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/soldertips/soldertip/solder-pot-maintenance-and-dross-removal

: Solder Contacting Component Bodies Issues of Burnt Flux on Class 3 PCB Assemblies Gold Removal Issues with Hollow Cup Connectors Acceptability of Conformal Coating Bubbles Have a question about

SolderTips: Gold Removal and Wave Soldering vs Hand Soldering - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering

.   More SolderTips Solder Pot Maintenance and Dross Removal What’s with the expiration dates on solder paste or wire? Accept or Reject: Solder Contacting Component Bodies Issues of Burnt Flux on Class 3 PCB Assemblies Gold Removal Issues with Hollow Cup Connectors Have a question about training or IPC certification

SolderTips: Issues With Incomplete Solder Reflow in Production | EPTAC

| https://www.eptac.com/soldertips/soldertips-issues-with-incomplete-solder-reflow-in-production-2/

. Recent Posts Solder Pot Maintenance and Dross Removal What’s with the expiration dates on solder paste or wire? Accept or Reject: Solder Contacting Component Bodies Issues of Burnt Flux on Class 3 PCB Assemblies Gold Removal Issues with Hollow Cup Connectors Acceptability of Conformal Coating Bubbles Search Looking for Training Products? SolderTraining.com can help

Gold Removal Issues with Hollow Cup Connectors - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/soldertips/soldertip/gold-removal-issues-with-hollow-cup-connectors

Gold Removal Issues with Hollow Cup Connectors - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf

. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints

Heller 公司

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