Technical Library: solder and paste and issues and gold and padas (Page 1 of 2)

Effect of Surface Oxide on the Melting Behavior of Lead-Free Solder Nanowires and Nanorods

Technical Library | 2013-07-18 12:12:40.0

Lead-free nanosolders have shown promise in nanowire and nanoelectronics assembly. Among various important parameters, melting is the most fundamental property affecting the assembly process. Here we report that the melting behavior of tin and tin/silver nanowires and nanorods can be significantly affected by the surface oxide of nanosolders.

Department of Chemical Engineering, University of Massachusetts

Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift

Technical Library | 2017-09-07 13:56:11.0

As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized.

Teledyne DALSA

Reliability of ENEPIG by Sequential Thermal Cycling and Aging

Technical Library | 2019-04-17 21:29:14.0

Electroless nickel electroless palladium immersion gold (ENEPIG) surface finish for printed circuit board (PCB) has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This paper presents the reliability of land grid array (LGA) component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.

Jet Propulsion Laboratory

2.5D and 3D Semiconductor Package Technology: Evolution and Innovation

Technical Library | 2017-09-14 01:21:52.0

The electronics industry is experiencing a renaissance in semiconductor package technology. A growing number of innovative 3D package assembly methodologies have evolved to enable the electronics industry to maximize their products functionality. By integrating multiple die elements within a single package outline, product boards can be made significantly smaller than their forerunners and the shorter interconnect resulting from this effort has contributed to improving both electrical performance and functional capability. (...) This paper outlines both positive and negative aspects of current 3D package innovations and addresses the challenges facing adopters of silicon and glass based interposer fabrication. The material presented will also reference 3D packaging standards and recognize innovative technologies from a number of industry sources, roadmaps and market forecasts.

Vern Solberg - Solberg Technical Consulting

Thermal Shock and Drop Test Performance of Lead-free Assemblies with No-Underfill and Corner-Underfill

Technical Library | 2014-01-02 15:56:55.0

With ROHS compliance the transition to lead-free is inevitable. Several lead-free alloys are available in the market and its reliability has been the main concern. The results from this experimental research aims at making a comparison of different lead-free alloy combinations. Thermal shock and drop tests are a part of this experimental study.

Jet Propulsion Laboratory

Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu-Pillar and BOT (Direct Bond on Substrate-Trace) Using TCNCP

Technical Library | 2015-12-02 18:32:50.0

(Thermal Compression with Non-Conductive Paste Underfill) Method.The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar micro-bump and TCNCP is one of the platform technologies, which is essentially required for 2.5D/3D chip stacking as well as cost effective SFF (small form factor) package enablement.Although the baseline packaging process methodology for a normal pad pitch (i.e. inline 50μm) within smaller chip size (i.e. 100 mm2) has been established and are in use for HVM production, there are several challenges to be addressed for further development for commercialization of finer bump pitch with larger die (i.e. ≤50μm tri-tier bond pad with the die larger than 400mm2).This paper will address the key challenges of each field, such as the Cu trace design on a substrate for robust micro-joint reliability, TCNCP technology, and substrate technology (i.e. structure, surface finish). Technical recommendations based on the lessons learned from a series of process experimentation will be provided, as well. Finally, this technology has been used for the successful launching of the company FPGA products with SFF packaging technology.

Altera Corporation

Failure Modes in Wire bonded and Flip Chip Packages

Technical Library | 2014-12-11 18:00:09.0

The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Wire bonded packages using conventional copper lead frame have been used in industry for quite some time. However, the demand for consumer electronics is driving the need for flip chip interconnects as these packages shorten the signals, reduce inductance and improve functionality as compared to the wire bonded packages. The flip chip packages have solder bumps as interconnects instead of wire bonds and typically use an interposer or organic substrate instead of a metal lead frame (...) The paper provides a general overview of typical defects and failure modes seen in package assembly and reviews the efforts needed to understand new failure modes during package assembly. The root cause evaluations and lessons learned as the factory transitioned to thin form factor packages are shared

Peregrine Semiconductor

test

Technical Library | 2015-12-15 19:45:22.0

testing

Rent-A-Geek, LLC

Evaluation, Selection and Qualification of Replacement Reworkable Underfill Materials

Technical Library | 2019-02-27 15:23:47.0

A study was performed to investigate, evaluate and qualify new reworkable underfill materials to be used primarily with ball grid arrays (BGAs), Leadless SMT devices, QFNs, connectors and passive devices to improve reliability. The supplier of the sole source, currently used underfill, has indicated they may discontinue its manufacture in the near future. The current underfill material is used on numerous circuit card assemblies (CCAs) at several sites and across multiple programs/business areas. In addition, it is used by several of our contract CCA suppliers.The study objectives include evaluation of material properties for down select, dispensability and rework evaluation for further down select, accelerated life testing for final selection and qualification; and process development to implement into production and at our CCA suppliers. The paper will describe the approach used, material property test results and general findings relative to process characteristics and rework ability.

Northrop Grumman Corporation

Screen Making for Printed Electronics- Specification and Tolerancing

Technical Library | 2018-03-28 14:54:36.0

Six decades of legacy experience makes the specification and production of screens and masks to produce repeatable precision results mostly an exercise in matching engineering needs with known ink and substrate performance to specify screen and stencil characteristics. New types of functional and electronic devices, flex circuits and medical sensors, industrial printing, ever finer circuit pitch, downstream additive manufacturing processes coupled with new substrates and inks that are not optimized for the rheological, mechanical and chemical characteristics for the screen printing process are becoming a customer driven norm. Many of these materials do not work within legacy screen making, curing or press set-up parameters. Many new materials and end uses require new screen specifications.This case study presents a DOE based method to pre-test new materials to categorize ink and substrate rheology, compatibility and printed feature requirement to allow more accurate screen recipes and on-press setting expectations before the project enters the production environment where time and materials are most costly and on-press adjustment methods may be constrained by locked, documented or regulatory processes, equipment limitations and employee experience.

Hazardous Print Consulting Inc

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