Technical Library: solder and pot and cleaning (Page 1 of 9)

Rework Challenges for Smart Phones and Tablets

Technical Library | 2015-04-23 18:48:18.0

Smart phones are complex, costly devices and therefore need to be reworked correctly the first time. In order to meet the ever-growing demand for performance, the complexity of mobile devices has increased immensely, with more than a 70% greater number of packages now found inside of them than just a few years ago. For instance, 1080P HD camera and video capabilities are now available on most high end smart phones or tablet computers, making their production more elaborate and expensive. The printed circuit boards for these devices are no longer considered disposable goods, and their bill of materials start from $150.00, with higher end smart phones going up to $238.00, and tablets well over $300.00.

Metcal

Increase Your Process Control and Lower Cost of Ownership

Technical Library | 2012-11-12 14:06:48.0

With consumers constantly looking for lower prices on their technology products and manufacturers trying to squeak out higher margins from their production lines, the need for process control and lower overhead costs have become even more important. One sector that is often overlooked is the hand soldering area of the factory. Many factories have been struggling with antiquated soldering systems for years. In some cases they are trying to make their investment in stations last much longer than they were designed for, or they are falsely trying to recoup their original investment ‐ all at the cost of higher operating expenses or even worse, reduced operator thru‐put.

Metcal

Combination of Spray and Soak Improves Cleaning under Bottom Terminations

Technical Library | 2014-10-23 18:10:10.0

The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller components, no-clean lead-free solder technologies, competitive forces and automated assembly create process challenges. Cleanliness under the bottom terminations must be maintained in harsh environments. Residues under components can attract moisture and lead to leakage currents and the potential for electrochemical migration (...) The purpose of this research study is to evaluate innovative spray and soak methods for removing low residue flux residues and thoroughly rinsing under Bottom Termination and Leadless Components

KYZEN Corporation

Hand Printing using Nanocoated and other High End Stencil Materials

Technical Library | 2019-05-29 23:10:30.0

There are times when a PCB prototype needs to be built quickly to test out a design. In such cases where it is known early on that there will be multiple iterations or that a "one and done" assembly will be made that there will be some SMT assemblers who choose to hand print solder paste onto the board using a "frameless" stencil. In such cases where hand printing is used, the consistency of the printing technique has typically been in question. Furthermore, the effectiveness of both the nanocoatings as well as the higher end stainless steel materials, which have been heretofore studied in controlled printing environments, will be evaluated for their impact on the hand printing process.The purpose of the study was to determine the effectiveness of select nanocoating materials as well as certain high end stainless steel stencil materials as they relate to the manual SMT printing process. A variety of nanocoatings were applied to SMT metal stencils and solder paste volume measurements were taken to compare the effectiveness.

BEST Inc.

Managing the transition on a global scale -- changing the cleaning agent means changes to equipment, processes, process control specifications and standards.

Technical Library | 1999-05-09 12:36:40.0

The production of electronics began with hand soldering, followed by manual cleaning, which reached its peak during the NASA program. Each step in the process tended to be considered on a stand alone basis, without thought being given to the preceding and following steps. Since each step had its own set of specifications, this led to a "patchwork" approach to overall quality.

DuPont

Effect of Surface Oxide on the Melting Behavior of Lead-Free Solder Nanowires and Nanorods

Technical Library | 2013-07-18 12:12:40.0

Lead-free nanosolders have shown promise in nanowire and nanoelectronics assembly. Among various important parameters, melting is the most fundamental property affecting the assembly process. Here we report that the melting behavior of tin and tin/silver nanowires and nanorods can be significantly affected by the surface oxide of nanosolders.

Department of Chemical Engineering, University of Massachusetts

Liquid Tin Corrosion and Lead Free Wave Soldering

Technical Library | 2008-02-12 22:52:41.0

Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant coatings and improved lead free solder alloys. The latest trends in protecting wave solder machine components from liquid metal corrosion by lead free solder alloys will be presented in order to provide guidelines for evaluating existing equipment as well as for purchasing new systems.

Speedline Technologies, Inc.

An investigation into low temperature tin-bismuth and tin-bismuth-silver lead-free alloy solder pastes for electronics manufacturing applications

Technical Library | 2013-01-24 19:16:35.0

The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.

Christopher Associates Inc.

Best Practices in Selecting Coatings and Pottings for Solar Panel Systems; Junction Boxes and Inverters

Technical Library | 2020-08-13 01:12:57.0

The solar industry has driven solutions that result in electronics systems that are required to perform in outside environments for over 25 years. This industry expectation has resulted in solutions to protect the electronics from failure that can result from interaction with moisture, and various chemicals leading to corrosion and shorting of the systems. Potting and encapsulation compounds can impart the very high level of protection from environmental, thermal, chemical, mechanical, and electrical conditions that the solar applications demand.

DfR Solutions

Dross and the Selective Soldering Process

Technical Library | 2011-02-24 19:20:14.0

In the selective soldering process, dross can be detrimental. Dross (and I use this term to encompass all surface contamination) is created in conjunction with the presence of Oxygen in two different areas of the process, and by separate means. Each must

Nordson SELECT

  1 2 3 4 5 6 7 8 9 Next

solder and pot and cleaning searches for Companies, Equipment, Machines, Suppliers & Information

SMT & Test Auction From All Over The West (Best in the West)

Best Reflow Oven
Online IPC Training & Certification

MSD Dry Cabinets
IPC Training & Certification - Blackfox

Easily dispense fine pitch components with ±25µm positioning accuracy.
decoating cleaning agent

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.