Industry Directory | Manufacturer
Global supplier of advanced thermal processing equipment and processes to the electronics assembly market.
New Equipment | Rework & Repair Equipment
Desktop Reflow Oven For Reballing and Prebumping of SMD Components The new MiniOven-04 is perfectly suitable for a wide range of applications, from small QFNs to very large BGAs. This is due to our extensive selection of stencils and masks for almos
New Equipment | Wave Soldering
Windows XP operation software with Chinese and English alternative available, whole machine under integration control can display the failure and save all production data for further analysis. External streamline design and modularized design inside
Electronics Forum | Thu Oct 04 10:54:11 EDT 2012 | eniac
I have only one incredible idea: this is example of different speed of heat transfer of neighboring pads. I saw it two times during last years, but on lead solder pastes (Sn63Pb37). The reason of this mistakes each times we found two: 1. errors duri
Electronics Forum | Fri Apr 22 14:28:38 EDT 2005 | Gary Goldberg - PROMATION
Low end selective laser soldering systems are limited to what types of soldering can be performed. I have read through the previous comments and find that most have commented on earlier technologies (which do not offer the features today's system do)
Industry News | 2021-06-30 04:28:57.0
Increases process capacity for large PCB panels by more than 54% with only 2% increase in footprint
Industry News | 2012-04-19 09:00:53.0
MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA Toronto Expo & Tech Forum,
SMTnet Express January 31, 2013, Subscribers: 26152, Members: Companies: 9105, Users: 34242 Projection Moiré vs. Shadow Moiré for Warpage Measurement and Failure Analysis of Advanced Packages There are three key industry trends that are driving
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/00600-248.pdf
). Also, a greater wetting force can be created during reflow in the case of an uneven deposition of paste on the pads. No. 4 — Using Nitrogen (vs. Air) Improves the Process
Heller 公司 | http://hellerindustries.com.cn/00600-248.pdf
). Also, a greater wetting force can be created during reflow in the case of an uneven deposition of paste on the pads. No. 4 — Using Nitrogen (vs. Air) Improves the Process
