Supply Chain Security: DFARS - Detection & Avoidance of Counterfeit Electronic Parts Online Version SMTnet Express, September 20, 2018, Subscribers: 31,325, Companies: 11,050, Users: 25,207 Supply Chain Security: DFARS - Detection & Avoidance
SMTnet Express, September 4, 2014, Subscribers: 23183, Members: Companies: 14034, Users: 36770 Counterfeit Integrated Circuits: Detection, Avoidance, and the Challenges Ahead. U. Guin, M. Tehranipoor; ECE Department, University of Connecticut, D
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk
