Industry Directory | Manufacturer of Assembly Material / Soldering
Global soldering materials manufacturer founded in 1980 headquartered in IL. U.S.A. Products include: RoHS lead free solders + leaded, Metals Recycling Program, Solder Check Up Program, Technical Support. ISO 9001:2015 Certified
New Equipment | Cleaning Equipment
The Sawa Eco-Roll eliminates waste and saves money by reusing wiper rolls for printing machines. The SC-ER360 cleans wiper rolls in just 20 minutes and measures W900 x D850 x H1200 mm. Sawa Stencil Cleaners are widely used in the Japanese electronic
New Equipment | Solder Materials
A unique blend of low oxide, high purity solder powder with various paste flux formulations. Qualitek has developed several types of high-performance Delta Solder Paste designed for use in Sn/Pb or for Pb-Free circuit board assembly. Qualitek offer
Electronics Forum | Sat Aug 05 12:12:05 EDT 2000 | Ramon I Garcia C
Hello Friends: I'm new in SMT process, I have a problem with little balls of solder beside of the component, I'm tried reducing the apertures in the stencil and making home base, some times the balls desappear, but some time not, and some times
Electronics Forum | Fri Oct 27 08:59:17 EDT 2000 | Wolfgang Busko
Antonio: A lot has been said on this topic before. You might try the archives with "solder balling" and than check your process step by step ( you will find enough ) to find the cause of your problem. Any other advice would be repeating and repeating
Used SMT Equipment | Repair/Rework
The Conceptronic Freedom 3000 printed circuit board repair station is designed for component rework, low volume prototype reflow soldering and process development. The Freedom 3000 machine structure is accurate, rigid, and stable in order to repeated
Used SMT Equipment | AOI / Automated Optical Inspection
Configuration Software version: 2.8.2 Build: 3298 Fourside cameras oblique view option FX seies (FXSC) Barcode Reader, Bottom-side 2D w/ USB Camera OLS-1 Expansion Modules. Description> Capture on the fly technology 3D
Industry News | 2010-03-10 15:39:10.0
March 2010 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will display its new XPii SMT modular pick-and-place system, along with its award-winning iineo SMT platform in booth 1E03 at the upcoming NEPCON China/EMT China 2010 exhibition and conference scheduled to take place April 20-22, 2010 in Shanghai, PR China.
Industry News | 2010-05-29 18:01:49.0
TORRANCE, CA — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, introduces M.S. Engineering Co. Ltd.’s PR1 BGA Solder Ball Checker for fast and accurate inspection of BGA soldering and QFP lead sections.
Parts & Supplies | Assembly Accessories
YAMAHA YS24 track mounter table Y axis tank chain keel drag chain KKE-M919F-00 YAMAHA YS24 track mounter table Y axis tank chain keel drag chain KKE-M919F-00 We also supply the below products: KHY-M71G5-A0 Z UNIT ASSY. YS12 Z-axis motor YG12 Z
Parts & Supplies | Assembly Accessories
Detailed Product Description Brand: SMC Part Name: Cylinder Part Number: J90650160C Model: CJ2R10-8.3B-KRJ Origin: China Condition: Original New J90650160C Feeder Cylinder For Samsung SM8mm Feeder 8mm feeder cylinder Deatail Information: 1,
Technical Library | 2020-01-28 00:23:58.0
This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control,Research and Development,Sales/Marketing
AOI - Omron RNS/RNS_ptH, VI3000, Marantz 22X IPC-610D Class 3, Pb/Pb free process, 5S, FMEA, MSA, PPAP, SPC, CPK, 6Sigma, lean manufacturing, Quality management, ISO/TS 16949 ,ISO 9001,ISO 14 001
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control
AOI - Omron RNS_ptH, RNS-LS, VT-WIN2 VI3000 Marantz 22X IPC 610D certified ISO 9001-2008, etc automotive standards ROHS
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
| https://qualitek.com/solder-powder/
. Interlocking of the powder reduces paste flowout. Reduction of shear thinning is important because it will prevent slumping and smearing which can result in solder bridging and solder balling
| https://store.aciusa.org/courses/bga_insp-rwk-rep.pdf
. However, process errors do occur and there is the likelihood of a solder joint defect (insufficient solder, bridging, solder balling, etc
