Industry Directory | Equipment Dealer / Broker / Auctions / Manufacturer
Focusing on the SMT field for more than 15 years, QYSMT has been committed to meeting the needs of customers and partners. Our mission is to provide the best solutions while helping to reduce costs and increase efficiency.
Our company was founded in 1992 .Sticking to the spirit of human-orientation, with the strong technological, perfect product and competitive price, TOLO has become one of the greatest make in soldering machine field in china.
New Equipment | Education/Training
IPC - Association Connecting Electronics Industries® offers globally recognized industry-traceable training and certification programs on key Electronics Industry Standards. Blackfox, founded in 1996, is the premier Worldwide Approved IPC Training Ce
semi-automatic PCB solder paste printer mainly applying soldering paste, which is made of tin particles and flux, to the PCB board. And let the component be soldered. Main Features: 1.Apply to Korea roller high-speed gui
Electronics Forum | Tue Jul 29 03:32:19 EDT 2014 | cmchoue
The solder in MB become to yellowish after thermal test (100 oC/12HR) I think the problem that is flux residue and I really want to know the principle that why it color change Thanks!!
Electronics Forum | Wed Sep 16 00:03:55 EDT 2009 | linseeg
We encoutered few PCB after IR reflow the PCB pad change color from silver to yellowish / brownish. Our IR reflow peak temp is ~250 degree. The brownish cannot be remove with IPA as well. What is the main reason causing this issue?
Used SMT Equipment | Soldering - Selective
This machine will become available for sale in September 2022. The machine is in complete & operational condition. For more information e-mail ashlin@bajabid.com
Used SMT Equipment | Soldering - Wave
this type can be added with nitrogen protection system 1 Flux spraying system 1.1 Spray fluxer can sense the board size automatically, and the spraying area can be adjusted according to the width of PCB. 1.2 Spray fluxer can sense the conveyor
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
BGA component installation demo with the Shuttle Star SV560 that has the Side View Camera option.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | IPC J-STD-001 Expert (CSE)
The IPC J-STD-001 CSE program confirms that an individual has demonstrated the level of knowledge and understanding required to act as a subject matter expert for the IPC J-STD-001 standard.
Events Calendar | Fri Jan 11 00:00:00 EST 2019 - Fri Jan 11 00:00:00 EST 2019 | Richardson, Texas USA
SMTA Dallas Chapter - Understanding Selective Solder Technology
Events Calendar | Tue Jun 02 00:00:00 EDT 2020 - Thu Jun 04 00:00:00 EDT 2020 | Markham, Ontario Canada
International Conference for Electronics Hardware Enabling Technologies (ICEHET)
Career Center | Burbank, California USA | Production
SMT Machine Operator Requirements: Set-up, and operate SMT Machinery Knowledge of PCB layout, fabrication and prototyping PCB layout, component placement, and routing Solder-Paste SMT placement machines and programming Pick-n-
Career Center | Mesa, Arizona USA | Production
Great opportunity with growing Tempe Company! Temp to hire Class II and III assemblers needed. First shift hours: Monday-Friday 6:45am to 3:15pm (half hour lunch) Second shift hours: Monday-Friday 3:30pm to 12:00am (half hour lunch) Class II s
Career Center | , Florida USA | Engineering,Management,Quality Control,Research and Development,Technical Support
Resourceful, innovative professional with over 15 years in the Electronic Industry, with domestic and international experience. Expertise in initiating projects and programs that boost efficiency and productivity while expanding employee education.
Career Center | Villupuram, India | Production
BE in ECE, Working in one of the EMS industry (V NET TECHNOLOGY PVT LTD) in Pondicherry. Above 4 years of experience in SMT & PTH Process Cum Production line. Keyskills Process control, Planning, Manpower, 5S, Kaizan, FMEA, Six sigma, OEE
Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. The purpose
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Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5108
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