New SMT Equipment: solder fillet (56)

Qualitek Solder Powder

New Equipment | Solder Materials

Solder powders are the key component of all solder pastes. Pastes made with the same flux but with powders that differ in particle sizes often have different rheological/physical properties resulting in differences in screen/stencil printing, compone

Qualitek International, Inc.

DJ-9000 DispenseJet Jet Technology

DJ-9000 DispenseJet Jet Technology

New Equipment | Dispensing

Jetting is the best way to dispense many fluids quickly and accurately. The DJ-9000 has a high shot-generation rate, can be cleaned in a few minutes, and has fast changeover of wetted parts. Speed, Flexibility, Process Control, Experience Based on

Nordson ASYMTEK

Electronics Forum: solder fillet (570)

Voids in solder fillet

Electronics Forum | Wed Apr 16 13:19:13 EDT 2003 | Takfire

Thanks Russ! The origianal complaint from the customer was in regards to what appeared as "bumpy" appearance and "holes" in the solder fillet. This problem was originally presented as an appearance issue only. Further investigation by our DPA lab r

Voids in solder fillet

Electronics Forum | Wed Apr 16 10:45:16 EDT 2003 | Takfire

Recent cross-section analysis for a customer complaint revealed voiding in the solder fillet. In some cases, the remains of outgassing were also observed. During the failure analysis, we also observed failures where the solder fillet wicked on the

Used SMT Equipment: solder fillet (8)

MVP Ultra 1820

MVP Ultra 1820

Used SMT Equipment | AOI / Automated Optical Inspection

Hello and thank you for your interest in our MVP Machine Vision Products AOI Machines For Sale. We have a total of (4) MVP Automated Optical Inspection Machines and (2) Inspection Repair Stations.. They were taken off line due to company closer. All

1st Place Machinery Inc.

MVP Ultra 18-20

MVP Ultra 18-20

Used SMT Equipment | AOI / Automated Optical Inspection

Description: Hello and thank you for your interest in our MVP AOI Machines For Sale.We have a total of (2)Ultra 18-20 MVP Automated Optical Inspection Machines,(1)CentOS based server. They were taken off line due to new machine installation would

SEM

Industry News: solder fillet (55)

CALTRONICS Purchases MIRTEC’s Award-Winning MV-6 OMNI 3D AOI Machine at SMTAI 2016

Industry News | 2016-11-01 19:52:12.0

MIRTEC, “The Global Leader in Inspection Technology,” announces that CALTRONICS Design & Assembly, Inc., a PCB Manufacturing and Electronic Design Company, purchased an award-winning MV-6 OMNI 3D AOI Machine during SMTA International in Rosemont, IL.

MIRTEC Corporation

MIRTEC Europe Wins “Best of Industry” Award

Industry News | 2019-11-12 13:01:33.0

MIRTEC has won an EM Best of Industry Award in the category of Automated Optical Inspection for its MV-6e OMNI. The award was presented to Bentec Distributor Accurex during a ceremony that took place 26 September at the Stellar Gymkhana in India. Bentec is the Managing Partner for UK/Ireland  and India for MIRTEC.

MIRTEC Corporation

Technical Library: solder fillet (73)

Advanced Solder Paste Dispensing

Technical Library | 2008-10-15 20:16:12.0

Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.

Nordson ASYMTEK

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Technical Library | 2012-12-17 22:05:22.0

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.

Nordson ASYMTEK

Videos: solder fillet (6)

Jetting enables simultaneous underfill of top & bottom levels of Package-on-Package applications. Shown jetting with the DispenseJet DJ-9000.

Jetting enables simultaneous underfill of top & bottom levels of Package-on-Package applications. Shown jetting with the DispenseJet DJ-9000.

Videos

Jetting enables simultaneous underfill of top & bottom levels of Package-on-Package applications. Shown jetting with the DispenseJet DJ-9000. http://www.nordsonasymtek.com

Nordson ASYMTEK

TR7500QE - 3D Automated Optical Inspection System

Videos

The TR7500QE AOI offers high performance 3D solder and assembly inspection by combining the next generation multi-angle 2D and 3D technologies based on 4-way adaptive digital fringe pattern projection and 4 side view cameras. Latest inspection softwa

TRI - Test Research, Inc. USA

Training Courses: solder fillet (5)

IPC-A-610 Certified IPC Trainer (CIT) Course

Training Courses | | | IPC-A-610 Trainer (CIT)

The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.

Circuit Technology Inc.

IPC-A-610 Trainer (CIT) Certification Training Course

Training Courses | | | IPC-A-610 Trainer (CIT)

The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.

Verion Training Systems, LLC

Events Calendar: solder fillet (1)

Role of Bismuth in Lead-free Electronics - SMTA Webtorial

Events Calendar | Wed Mar 14 00:00:00 EDT 2018 - Wed Mar 14 00:00:00 EDT 2018 | ,

Role of Bismuth in Lead-free Electronics - SMTA Webtorial

Surface Mount Technology Association (SMTA)

Career Center - Resumes: solder fillet (2)

my cv

Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control,Research and Development,Sales/Marketing

AOI - Omron RNS/RNS_ptH, VI3000, Marantz 22X IPC-610D Class 3, Pb/Pb free process, 5S, FMEA, MSA, PPAP, SPC, CPK, 6Sigma, lean manufacturing, Quality management, ISO/TS 16949 ,ISO 9001,ISO 14 001

my cv

Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control

AOI - Omron RNS_ptH, RNS-LS, VT-WIN2 VI3000 Marantz 22X IPC 610D certified ISO 9001-2008, etc automotive standards ROHS

Express Newsletter: solder fillet (859)

Partner Websites: solder fillet (90)

Solder Selection Guide

Nordson ASYMTEK | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide

. The following are a few examples of flux characteristics that modify how a solder paste performs. Restricted Residue NC 26D04 flux residue remains either on or very close to the fillet after reflow

Nordson ASYMTEK

PCB Libraries Forum : New 2016 Solder Joint Goals

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_new-2016-solder-joint-goals_topic1921.xml

length for a better solder fillet? Is there any rule of thumb in this situations? I was looking at IPC-7351 and couldn't find any info that relates the lead thickness to the pad size. 

PCB Libraries, Inc.


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