ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. Disturbed Solder Joint A solder fillet that solidified while the solder joint was moving. The result is a distorted fillet with an irregular surface texture
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
. Disturbed Solder Joint A solder fillet that solidified while the solder joint was moving. The result is a distorted fillet with an irregular surface texture
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/about-us/quality-assurance
. As such, each solder paste product must meet stringent product application requirements, including: Fine pitch Enhanced wetting Low residue Lead-free shiny fillet Halide-free
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_new-2016-solder-joint-goals_topic1921.xml
length for a better solder fillet? Is there any rule of thumb in this situations? I was looking at IPC-7351 and couldn't find any info that relates the lead thickness to the pad size.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide
. The following are a few examples of flux characteristics that modify how a solder paste performs. Restricted Residue NC 26D04 flux residue remains either on or very close to the fillet after reflow. This feature is most important with NC formulations
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-frequently-asked-questions
? Four effects are more significant than others. Increased surface tension of molten solder alloy changes fillet shapes, improves part centering, and may increase tombstoning
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2306&OB=ASC.html
. The problem is more obvious for QFN parts. When using the "least" setting the it looks like the toe is just too short and the solder creates a bubble shaped contact instead of a nice fillet
| https://www.eptac.com/soldertips/accept-or-reject-solder-contacting-component-bodies/
– 8.3.5.5 Flat Gull Wing Leads p Maximum Heel Fillet Height (E). The overall intent is that the solder can climb up the lead but not touch the body
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-chip-component-solder-joints_topic2588_post11181.html
as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipcjstd001-chip-component-solder-joints_topic2588_post11181.html
as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is
