New Equipment | Test Equipment
SAKI AOI BF-Frontier II Resolution 18μm Board size:460×500mm Dimension:850 × 1340 × 1230mm weight:450kg Product description: SAKI AOI BF-Frontier II, Resolution 18μm, Board size:460×500mm, Dimension:850 ×
New Equipment | Test Equipment
SAKI AOI BF-Frontier II Resolution 18μm Board size:460×500mm Dimension:850 × 1340 × 1230mm weight:450kg Product description: SAKI AOI BF-Frontier II, Resolution 18μm, Board size:460×500mm, Dimension:850 ×
Electronics Forum | Wed Apr 16 16:55:38 EDT 2003 | russ
Thanks for the info, Here is a couple more questions (and you thought you were done) What size are these caps /res? how thick is your stencil? what type of oven are you using? what is the finish of the board? Anyway, it seems like (from a distance)t
Electronics Forum | Wed Apr 06 11:10:47 EDT 2005 | smt_rookie
We process a double-side reflow board (10 ups). Chips and IC's on the bottom side while chips, IC's plus thru-hole connectors and IC sockets on top side (bottom side first then top side reflow). In the past, we were not encountering any soldering pro
Used SMT Equipment | AOI / Automated Optical Inspection
OMRON AOI VT-S720-A MACHINE Hardware Configuration Image signal input unit Main unit Power supply Air Camera Illumination Image resolution Feed method Line height PCB carrier width adjustment Ambient operating temperature Ambient opera
Used SMT Equipment | AOI / Automated Optical Inspection
R Front Rail Fixed Application Version: 7.20C (RNS) Ladder Version: 7.100B (RNS) Image Resolution: 15um AC 120V, 2 Phase, 50/60 Hz, 1.5 kVA Max Current: 15A Hardware Configuration: Image Signal Input Unit: - Camera: 3-CCD Camera - Illumi
Industry News | 2017-01-18 05:21:35.0
This photo CD ROM provides the process or quality engineer with a source of PIHR photographs of the assembly process, components and process defects which may be used in company inspection document or training presentations. They may be simply pasted into any document for in house company use. Now over 250 photographs are provided in either jpg or tif file format for use in PowerPoint, Word inspection standards or online publications royalty free http://www.bobwillis.co.uk/product-category/photo-cd-rom/
Industry News | 2018-10-18 08:43:30.0
Pin-in-Paste Reflow Calculations and Special Cases
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
Featured Article Return to Front Page REFLOW SOLDERING
| http://etasmt.com/cc?ID=te_news_industry,24564&url=_print
component’s terminals not catching the solder during the reflow process. Dewetting is a condition that results when molten solder coats a surface and then recedes leaving irregularly-shaped mounds of solder separated by areas covered with a thin film of solder and with the base metal
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-chip-component-solder-joints_topic2588_post11181.html
0.50 mm is an acceptable solder fillet height because it’s less than 1.00 mm. But what about an 01005 chip resistor with a 0.13 mm height? Using a 0.075 stencil thickness, J-STD-001 recommends a Toe fillet of