New SMT Equipment: solder issues on gold contacts (258)

Selective Soldering System Ersa ECOSELECT 1

Selective Soldering System Ersa ECOSELECT 1

New Equipment | Wave Soldering

http://www.flason-smt.com/product/Selective-Soldering-System-Ersa-ECOSELECT-1.html Selective Soldering System Ersa ECOSELECT 1 Selective Soldering System Ersa ECOSELECT 1 Selective Soldering Machine Selective Soldering System Ersa ECOSELECT 1

Flason Electronic Co.,limited

Flason SMT Selective Soldering System Ersa ECOSELECT 1

Flason SMT Selective Soldering System Ersa ECOSELECT 1

New Equipment | Selective Soldering

Flason SMT Selective Soldering System Ersa ECOSELECT 1 Selective Soldering System Ersa ECOSELECT 1 Selective Soldering Machine Selective Soldering System Ersa ECOSELECT 1 Product description: Selective Soldering System Ersa ECOSELECT 1  IN

Flason Electronic Co.,limited

Electronics Forum: solder issues on gold contacts (96)

solder on gold finger

Electronics Forum | Tue Apr 17 21:30:27 EDT 2001 | davef

The issue is on the table. Which is it? Are you ... * Loosing your gold plate when you remove the tape? [A tape test is a standard test for evaluating gold fingers. Check IPC-TM-650, test number wachacallit. Checkitaut.] OR * Putting tape o

solder stain on gold finguers

Electronics Forum | Fri Feb 23 12:24:59 EST 2001 | traviss

200-300u that�s tinny but I read IPC as saying ANY metal other than gold in the critical contact areas is not acceptable.

Industry News: solder issues on gold contacts (35)

Video Demonstration for HIOKI 1240 Flying Probe Tester with New Software Programming Feature Is Now Live on Seika TV

Industry News | 2013-04-18 11:08:20.0

Seika Machinery, Inc., announces that it has added a video demonstration of the HIOKI 1240 Flying Probe Tester with the new software programming feature to Seika TV.

Seika Machinery, Inc.

Registration Open for IPC’s Conference on Solderability and Reliability for Electronics Assemblies in Budapest Industry experts to present on technical and business issues

Industry News | 2012-12-17 19:16:10.0

IPC — Association Connecting Electronics Industries® announces registration is now open for the IPC Conference on Solderability and Reliability for Electronics Assemblies.

Association Connecting Electronics Industries (IPC)

Technical Library: solder issues on gold contacts (83)

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Technical Library | 2021-01-03 19:24:52.0

Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.

SMTnet

Platings for Interconnections

Technical Library | 2019-06-04 10:19:46.0

Interconnection technology relies very heavily on the ability of the conductors on a printed wiring assembly to maintain reliable signal integrity. Harsh environmental factors can precipitate a loss of conductivity due to oxidation and corrosion. Connections are typically soldered or inserted using pressure fitted connectors to obtain enough surface contact to meet the electrical conductivity requirements. In pressure contacts, surface integrity is especially critical where the abrasive effects of retraction and insertion can wear off the metallic finish from the contact area. This can expose the underlying copper or nickel and lead to increased resistance at the contact points. These types of conductors are frequently found in card edge connectors where the terminations are plated with a layer of nickel and gold (frequently referred to as gold fingers). A hard gold is typically used containing very small amounts of nickel and cobalt to increase the wear resistance.

ACI Technologies, Inc.

Express Newsletter: solder issues on gold contacts (1112)

SMTnet Express - August 7, 2014

SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk

SMTnet Express - July 24, 2014

aluminum or gold wire. Gold wire provides the abilit

Partner Websites: solder issues on gold contacts (142)

Vacuum Reflow Processing On Solder Joint Voiding

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf

Vacuum Reflow Processing On Solder Joint Voiding To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL

Heller Industries Inc.

The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf

The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL

Heller 公司


solder issues on gold contacts searches for Companies, Equipment, Machines, Suppliers & Information

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Count On Tools, Inc.
Count On Tools, Inc.

COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.

Contract Manufacturer / Manufacturer of Assembly Equipment / Manufacturer of Assembly Material / Pick and Place / Repair / Rework

2481 Hilton Drive
Gainesville, GA USA

Phone: (770) 538-0411