New SMT Equipment: solder issues on gold contacts (258)

Selective Soldering System Ersa ECOSELECT 1

Selective Soldering System Ersa ECOSELECT 1

New Equipment | Wave Soldering

Selective Soldering System Ersa ECOSELECT 1 Selective Soldering System Ersa ECOSELECT 1 Selective Soldering Machine Selective Soldering System Ersa ECOSELECT 1 Product description: Selective Soldering System Ersa ECOSELECT 1,Selective Solderin

Flasonsmt Co.,ltd

Ersa ECOSELECT 1 Selective Soldering System

Ersa ECOSELECT 1 Selective Soldering System

New Equipment | Wave Soldering

Ersa ECOSELECT 1 Selective Soldering System PCB:424 x 508 mm PCB weight: 8 kg Mini-wave 13 kg up to 2 pots Electromagnetic solder pot Product description: Ersa ECOSELECT 1 Selective Soldering System, PCB:424 x 508 mm, PCB weight: 8 kg, Mini-wa

Flasonsmt Co.,ltd

Electronics Forum: solder issues on gold contacts (96)

solder on gold finger

Electronics Forum | Tue Apr 17 21:30:27 EDT 2001 | davef

The issue is on the table. Which is it? Are you ... * Loosing your gold plate when you remove the tape? [A tape test is a standard test for evaluating gold fingers. Check IPC-TM-650, test number wachacallit. Checkitaut.] OR * Putting tape o

solder stain on gold finguers

Electronics Forum | Fri Feb 23 12:24:59 EST 2001 | traviss

200-300u that�s tinny but I read IPC as saying ANY metal other than gold in the critical contact areas is not acceptable.

Industry News: solder issues on gold contacts (49)

Registration Open for IPC’s Conference on Solderability and Reliability for Electronics Assemblies in Budapest Industry experts to present on technical and business issues

Industry News | 2012-12-17 19:16:10.0

IPC — Association Connecting Electronics Industries® announces registration is now open for the IPC Conference on Solderability and Reliability for Electronics Assemblies.

Association Connecting Electronics Industries (IPC)

IPC Conference on Electronics Assembly in Budapest Offers Critical Information for Eastern Europe’s Fast-Growing Industry

Industry News | 2012-01-07 21:33:05.0

To support the consistent and rapid growth in Eastern Europe’s electronics assembly industry, IPC will hold its second annual IPC Conference on Electronics Assembly: Soldering, Assembly & Inspection in Budapest, Hungary, on 20-22 March 2012. This three-day event includes workshops, a two-day technical conference and a tabletop exhibition, providing myriad opportunities for participants to network with industry experts and gain insight into new technologies and trends in this key market.

Association Connecting Electronics Industries (IPC)

Technical Library: solder issues on gold contacts (3)

Surface Finish Issues Affecting Solderability and Reliability

Technical Library | 2019-06-07 14:49:54.0

ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins.

ACI Technologies, Inc.

No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability

Technical Library | 2013-04-11 15:43:17.0

With the explosion of growth in handheld electronics devices, manufacturers have been forced to look for ways to reinforce their assemblies against the inevitable bumps and drops that their products experience in the field. One method of reinforcement has been the utilization of underfills to "glue" certain SMDs to the PCB. Bumped SMDs attached to the PCB with a no-clean soldering process offer the unavoidable scenario of the underfill coming in contact with a flux residue. This may or may not create a reliability issue... First published in the 2012 IPC APEX EXPO technical conference proceedings

Indium Corporation

Express Newsletter: solder issues on gold contacts (1188)

SMTnet Express - August 7, 2014

SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk

SMTnet Express - July 24, 2014

aluminum or gold wire. Gold wire provides the abilit

Partner Websites: solder issues on gold contacts (213)

Vacuum Reflow Processing On Solder Joint Voiding

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf

Vacuum Reflow Processing On Solder Joint Voiding To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL

Heller Industries Inc.

Vacuum Reflow Processing On Solder Joint Voiding

Heller 公司 | https://hellerindustries.com.cn/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf

Vacuum Reflow Processing On Solder Joint Voiding To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL

Heller 公司


solder issues on gold contacts searches for Companies, Equipment, Machines, Suppliers & Information

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Count On Tools, Inc.
Count On Tools, Inc.

COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.

Manufacturer

2481 Hilton Drive
Gainesville, GA United Arab Emirates

Phone: (770) 538-0411