http://www.flason-smt.com/product/Selective-Soldering-System-Ersa-ECOSELECT-1.html Selective Soldering System Ersa ECOSELECT 1 Selective Soldering System Ersa ECOSELECT 1 Selective Soldering Machine Selective Soldering System Ersa ECOSELECT 1
Flason SMT Selective Soldering System Ersa ECOSELECT 1 Selective Soldering System Ersa ECOSELECT 1 Selective Soldering Machine Selective Soldering System Ersa ECOSELECT 1 Product description: Selective Soldering System Ersa ECOSELECT 1 IN
Electronics Forum | Tue Apr 17 21:30:27 EDT 2001 | davef
The issue is on the table. Which is it? Are you ... * Loosing your gold plate when you remove the tape? [A tape test is a standard test for evaluating gold fingers. Check IPC-TM-650, test number wachacallit. Checkitaut.] OR * Putting tape o
Industry News | 2013-04-18 11:08:20.0
Seika Machinery, Inc., announces that it has added a video demonstration of the HIOKI 1240 Flying Probe Tester with the new software programming feature to Seika TV.
Industry News | 2012-12-17 19:16:10.0
IPC — Association Connecting Electronics Industries® announces registration is now open for the IPC Conference on Solderability and Reliability for Electronics Assemblies.
Technical Library | 2019-06-07 14:49:54.0
ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins.
Technical Library | 2013-04-11 15:43:17.0
With the explosion of growth in handheld electronics devices, manufacturers have been forced to look for ways to reinforce their assemblies against the inevitable bumps and drops that their products experience in the field. One method of reinforcement has been the utilization of underfills to "glue" certain SMDs to the PCB. Bumped SMDs attached to the PCB with a no-clean soldering process offer the unavoidable scenario of the underfill coming in contact with a flux residue. This may or may not create a reliability issue... First published in the 2012 IPC APEX EXPO technical conference proceedings
SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk
aluminum or gold wire. Gold wire provides the abilit
Vacuum Reflow Processing On Solder Joint Voiding To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL
The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL