New SMT Equipment: solder joints (Page 1 of 52)

DSP618D No-Clean Lead Free Solder Paste Syringe Dispensing

New Equipment | Solder Materials

DSP 618D no clean lead free solder paste has been specifically designed for syringe dispensing applications. Product features include: low residues, easy to dispense, extended tack time, excellent wettability. Hard residues are non-conductive and sol

Qualitek International, Inc.

Stainless Steel Brush (2 5/16") SH-60

Stainless Steel Brush (2 5/16") SH-60

New Equipment | Rework & Repair Equipment

Stainless Steel Brush (SH-60) 2 5/16" Made of over 300 long, fine, stainless steel bristles. Use to clean flux from solder joints, clean flux and adhesive from solder pad and for general cleaning purposes. Available in Standard and Miniature

Beau Tech

Stainless Steel Brush (3 1/2") SH-61

Stainless Steel Brush (3 1/2") SH-61

New Equipment | Rework & Repair Equipment

Made of over 300 long, fine, stainless steel bristles. Use to clean flux from solder joints, clean flux and adhesive from solder pad and for general cleaning purposes. Available in Standard and Miniature sizes.  Stainless Steel Brush (3 1/2"

Beau Tech

Delta Solder Paste

Delta Solder Paste

New Equipment | Solder Materials

A unique blend of low oxide, high purity solder powder with various paste flux formulations. Qualitek has developed several types of high-performance Delta Solder Paste designed for use in Sn/Pb or for Pb-Free circuit board assembly.  Qualitek offer

Qualitek International, Inc.

NC600 Lead-Free, No-Clean Solder Wire

NC600 Lead-Free, No-Clean Solder Wire

New Equipment | Solder Materials

Qualitek has developed a unique no clean flux system designed specifically for high temperature lead free alloys. Utilizing synthetically refined resin and very effective activator, NC600 wets and spreads like an RA type. NC600 exhibits virtually no

Qualitek International, Inc.

WS700 Lead Free Water Soluble (OA) Solder Wire

WS700 Lead Free Water Soluble (OA) Solder Wire

New Equipment | Solder Materials

Lead free water-soluble wire solder. Provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. WS700 exhibits virtually no spattering. WS700 conforms to J-STD-004, ORH1. Main Features Excellent wettability

Qualitek International, Inc.

SN100e Alloy A Lead-Free Silver Free Option

SN100e Alloy A Lead-Free Silver Free Option

New Equipment | Solder Materials

This unique patented alloy has been developed as a lead free alternative for those now using costly SAC alloys and for those switching from lead containing Sn63/Pb37 alloys to the lead free process. SN100e is manufactured from tin, copper, and cobalt

Qualitek International, Inc.

No-Clean Soldering Fluxes

No-Clean Soldering Fluxes

New Equipment | Solder Materials

Qualitek no-clean fluxes are formulated to meet the changing requirements for today's soldering operations. Designed for wave soldering conventional and SMT circuit board assemblies, these extremely low solids content fluxes leave practically no resi

Qualitek International, Inc.

DSP 825HF No-Clean Solder Paste Halogen Free Lead Free

DSP 825HF No-Clean Solder Paste Halogen Free Lead Free

New Equipment | Solder Materials

DSP 825HF is a lead-free, no clean, halogen-free solder paste designed specifically for a wide range of lead-free alloys. It provides an x-treme fluxing activity level with excellent wetting on copper OSP-coatings. Wide reflow process windows combine

Qualitek International, Inc.

HYDRON® WS 400 - Aqueous-based Cleaning Medium for Defluxing

HYDRON® WS 400 - Aqueous-based Cleaning Medium for Defluxing

New Equipment | Cleaning Agents

HYDRON® WS 400, based on the FAST® Technology, is an aqueous based cleaning agent specifically designed to remove water-soluble (OA) flux residues from electronic assemblies and is compatible with sensitive metals. Applied at low concentrations (3% t

ZESTRON Americas

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