New Equipment | Cleaning Equipment
Automatic SMT Stencil Cleaning Machine BMP-1000X Feature ▶The cleaning tank, the original tank, and the spray tank are designed with a liquid level sensor overflow alarm. ▶The opening of the front door is designed with photoelectric sensor protectio
New Equipment | Solder Paste Stencils
BEST custom manufactures a vareity of stencils including miniature rework stencils. These stencils are designed to rework specific component locations. These component stencils feature flaps on their sides in order to prevent solder paste form leachi
Electronics Forum | Mon Jul 24 11:35:42 EDT 2006 | Jimk@ics-inc.org
We have experienced a problem with tin leaching or discoloration of lead terminals on random parts on solder side of a paste/paste operation. The profile has been used on previous production runs and there doesn't appear to be any heat damage to othe
Electronics Forum | Tue Nov 04 12:58:17 EST 2008 | smt123
I have to agree with Patrick here. This image appears to show a board that is NOT HASL as there is what appears to be a copper pad in the upper portion of the image. But then again the arrow tip appears to be white and I woudl expect that to be red s
Industry News | 2015-04-30 19:57:55.0
SMTA China announces that it presented awards for seven papers at the SMTA China East 2015 Conference Award Presentation Ceremony, held on Tuesday, April 21, 2015 at Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.
Industry News | 2011-08-18 21:23:09.0
For an industry that is constantly advancing, the technical conference at IPC Midwest Conference & Exhibition on September 21–22, in Schaumburg, Ill., will feature five sessions offering the latest research, methodologies and insights from industry experts to address critical challenges of manufacturing defect-free, quality electronics.
Defect Free QFN Assembly Defect Free QFN Assembly The problem with soldering QFN packages is that they float, skew and tilt on the 'domed' melted solder during the SMT re-flow process. This floating, skewing and/or tilting will lead to solder
Heller Industries Inc. | https://hellerindustries.com/causes-defects-reflow-soldering/
Intermetallics Appearance Component Cracking Bridging Grainy Solder Laminate Discoloration Leaching Halo Effect Discolored Joint help@hellerindustries.com 1-800-394-OVEN 1-800-394-OVEN Company About News Events Careers Heller Blog Certifications Equipment Convection Reflow Ovens New
