We are Japanese based solder manufacturer under Nihon Genma Mfg Co Ltd. Our company located in Malaysia and we distribute solder products worldwide. We are looking for aggresive business partner around the world. Contact us!!
TTPL is a reputed EMS(Electronic Manufacturing Service) company offering PCBA, testing and box build on turnkey basis. Certified to ISO/TS16949, TTPL has been offering assembly services at superior quality since 1992.
Features: 1. A comprehensive cleaning system: the surface of the product residues of organic matter, inorganic substances for thorough and effective cleaning; 2. Automatic cleaning mode: in a clean room to complete the cleaning, rinsing, drying all
The MPM® Momentum® II BTB™ (Back to Back) configurable stencil printer allows dual-lane processing for higher throughput but without increasing either line length or capital investment. The Momentum II BTB stencil printer is t
Electronics Forum | Tue Apr 19 07:37:48 EDT 2005 | mirrindolan
I am looking for all the reasons why operators and stores must let solder paste reach room temperature. I am trying to make it is as easy as possible for everyone to understand. I have compiled all the obvious reasons but I am open to all comments an
SMTmax reflow oven family of high-throughput thermal processing system is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. SMTmax F6 systems provide optimized lead-f
Industry News | 2014-04-16 09:02:14.0
Europlacer announces that it will showcase the new Lzero3, along with the iineo-II and Speedprint SP710avi, in Booth #B-1C25 at NEPCON China, which is scheduled to take place April 23-25, 2014 at the Shanghai World Expo & Exhibition Convention Center (Hall 1) in Shanghai, China.
Industry News | 2019-01-15 19:49:03.0
ZESTRON is pleased to announce that Jigar Patel, M.S.Ch.E., Senior Application Engineer, will present “Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection” at the IPC APEX 2019 in San Diego, CA.
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2009-07-01 09:24:25.0
During the last 5 years, the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome.i A new methodology has been recently developed to further increase the propensity for successful cleaning.ii At the core of this method is the thermal identification of the residue matrix. Thermal energy changes the physical state, i.e. transitions between liquid, solid and gas phases. By taking advantage of such specific information during phase transitions, the cleaning process can be tailored to such settings, which in turn increases the cleaning success significantly.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | Colton, California USA | Engineering,Maintenance,Production,Quality Control,Research and Development,Technical Support
• Strong experience with the installation, training, and repair on a variety of electro-mechanical, pneumatic, PLC, or computer controlled systems. • Strong Knowledge in SMT equipment, Screen Printer, AOI/SPI, Conformal Coat Systems, Reflow oven, X-R
,989, Users: 41,258 Room Temperature Fast Flow Reworkable
. Smooth operation, low noise, temperature return naturally and bubble remove in the process of mixing. 4. There is no need to open cover for solder paste pot and it is convenient and safe for pick-and-place. 5
. The rotating speed has proved by practice, so the impact against the tin power and the effect to solder paste quality in the rising temperature are avioded