New Equipment | Cleaning Agents
Introducing DJAW-10, our efficient under stencil wipe solvent compatible with all AIM solder pastes. Ideal for manual or automated application, DJAW-10 reduces solder paste dry-out, enhances fine aperture release, and cuts wipe cycles by 50% compared
Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 lead-free soldering paste SMT Solder Paste Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 flux solder paste Product description: Sn96.5Ag3.0Cu0.5 no-clean Solder Paste NP560 is a no-clean, lead-free,
Electronics Forum | Tue Feb 22 17:57:32 EST 2005 | Austinj
Most solder paste has a shelf life of 1 week at room temperature after opened, if resealed at the end of the shift/day. Most shelf lives are 4-6 months at 40F (refridgerated) or 1 month at room temp (unopened/sealed). Recommended stencil life is appr
Electronics Forum | Wed Dec 09 09:47:32 EST 2009 | dyoungquist
I am curious as to why you need to mix.... We use a 500g cartridge with air gun. Our process is remove the cartridge from the fridge, allow it to warm up to room temperature before inserting into air gun, then apply bead of paste to the stencil. N
Industry News | 2016-09-08 17:26:45.0
Kester will be exhibiting (booth #500) at Surface Mount Technology Association International (SMTAI) 2016, which will take place September 27-28 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2018-10-09 14:46:48.0
Kester will be exhibiting (booth #117) at SMTAI 2018, which will take place October 16-17 at the Donald Stephens Convention Center in Rosemont, IL.
,989, Users: 41,258 Room Temperature Fast Flow Reworkable
| https://www.eptac.com/solder-tips/
? Read Answer Solder Paste Shelf Life and Testing Question: We have some solder paste that has been in a sealed box at 4 degree Celsius for more than 8 months
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
. Solder paste needs adequate reflow temperature to melt, wet, and interact with the copper pad or other board metallization and component metallization to form the solder joint
