New Equipment | Board Handling - Conveyors
American SMT Assembly line Wave soldering machine in feed conveyor Factory Demensions:1000*700*750(mm) PCB width:0-350(mm) Conveyor speed:0-2000(mm)/Min Weight:Approx.45Kg Product description: American SMT Assembly line Wave soldering machine
Wave soldering machine in feed conveyor Demensions:1000*700*750(mm) Wave soldering machine in feed conveyor PCB width:0-350(mm) Conveyor speed:0-2000(mm)/Min Product description: Wave soldering machine in feed conveyor , Demensions:1000*700*75
Electronics Forum | Mon Nov 02 22:02:01 EST 2009 | boardhouse
Umar - the boards are not assembled - so Solder splash is not applicable. Solder resist does not Melt it cures. As a board supplier I would not want my clients to adapt if they are receiving crap product, I would expect them to leave.
Electronics Forum | Mon Nov 02 07:16:47 EST 2009 | umar
Base on the top picture condition, seems like the boards condition is a lot with solder splash or solder ball which is per IPC-610 is under reject (under 5.6.2)for class 3 product. While the picture 2 is showing those the solder resist is not melt pr
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2008-03-25 23:53:54.0
Comment from Brian D�Amico, President
Technical Library | 2023-09-15 10:06:49.0
Enhance your electronics manufacturing with our SMT On-line 3D Solder Paste Inspection Machine. Achieve unmatched precision and accuracy in solder paste inspection for optimal PCB assembly. Streamline your production process and minimize defects with cutting-edge 3D technology. Explore how this machine can revolutionize your soldering process and ensure top-quality electronics.
Technical Library | 2015-04-29 03:48:39.0
SPI equipment is routinely used in Printed Circuit Board (PCB) manufacturing to monitor and control one of the most crucial steps affecting the finished quality of circuit board. Solder paste deposition is the key process in board assembly operations using SMT techniques. Our LSM™ system was the industry's first popular method of manually inspecting solder paste; our SE systems revolutionized SMT production by offering an automated method for performing in-process 3D inspection on the assembly line. SPI systems measure the height and volume of the solder pads before the components are applied and the solder melted, and when used properly, can reduce the incidence of solder-related defects to statistically insignificant amounts. Critical to the SPI measurement is the accuracy of the height measurement because that has a direct correlation with solder volume and defects.
| https://unisoft-cim.com/view-markup_quoting_solder-joint-count-defect-per-million-operations-dpmo-report.html
Solder Joint Count - Defect Per Million Operations (DPMO) Report | Unisoft Manufacturing Software | Unisoft ≡ Menu Skip navigation For over 35 years, Intelligent PCB Manufacturing Automation Software Be production ready in minutes, not days
| https://www.eptac.com/soldertips/soldertips-issues-with-incomplete-solder-reflow-in-production-2/
: Issues With Incomplete Solder Reflow in Production Question: We have some PCB assemblies that show incomplete solder flow due to signs of flux exhaustion
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