Electronics Forum | Tue Sep 22 11:20:08 EDT 1998 | S Maganti
We are getting into a lot of double sided boards offlate. Our customer is loading a lot of RNETS, Diodes ( MINLS, SOT23s and other 2 leaded diodes ). We are processing it through a traditional glue process and wave soldering the SMT parts along with
Electronics Forum | Tue Sep 22 13:14:27 EDT 1998 | Chrys
| We are getting into a lot of double sided boards offlate. Our customer is loading a lot of RNETS, Diodes ( MINLS, SOT23s and other 2 leaded diodes ). We are processing it through a traditional glue process and wave soldering the SMT parts along wit
Electronics Forum | Wed Nov 06 17:50:46 EST 2002 | davef
I hear you on the profiling issue. That won't get at the issue any how. Your observation of solder wetting confirms that solderability is NOT the issue. You may be seeing a "cold solder connection". The issue is the TCE of the different materia
Electronics Forum | Wed Nov 06 10:31:30 EST 2002 | davef
First, from what you say, it's unclear that there is a "solderability" issue with your connectors. Different appearance of the soldered connection from one side of the connector to the other is what we're talking about [I think]. But it is curious.
Electronics Forum | Tue Nov 05 18:17:00 EST 2002 | russ
This sounds like a contamination issue with the HASL finish.(solder on lead but not on pad). I have experienced this before and it was related to the HASL process at our supplier. They found some type of contaminate in the bath (unfortunately I can
Electronics Forum | Thu Oct 28 15:53:27 EDT 2010 | dwonch
Ok, just to put closure on things I figured I should post the conclusion of this whole ordeal. We've acquired a new BGA rework station that allows us to get away without tenting our vias under the BGAs. This allowed us to change our PCB spec to rem
Electronics Forum | Fri Oct 29 11:42:04 EDT 2010 | pfloh
For my opinion, this will not the end for you yet if supplier unable to provide you the rootcauses and corrections. I faced this more than 3 times within 2 years. All type of lab tests (SEM, FTIR,cross-sectioning,solderability tests, and etc.) They
Electronics Forum | Sat Apr 17 10:44:21 EDT 2010 | kcorrin
Sounds like you and your board suppliers have done alot of work with this issue trying to solve the problem. When I got into this situation previously, I relied on an outside lab to help me. We didn't have SEM or any testing capability at my shop eit
Electronics Forum | Mon Sep 20 11:21:48 EDT 2010 | tony1
I have this NiPdAu small QFN packge sizes less than 2x2. I tried to do solderability Dip And Look test and there's always some units no wet on either ground pad and small I/O. Can someone help to explain why is this so difficult to set on this surfac
Electronics Forum | Mon Apr 19 15:45:21 EDT 2010 | dwonch
Thanks to all for your input. We did have a third party do an analysis on boards from the first shop. They were shipped directly from the board shop to eliminate the possibility that we could contaminate them. The third party (Forsite) did find Sili
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