| https://www.eptac.com/faqs/ask-helena-leo/ask/shelf-life-of-soldered-components
Shelf Life of Soldered Components - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/ask/scoring-of-soldered-boards-with-online-testing/
Scoring of Soldered Boards with Online Testing - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/faqs/ask-helena-leo/ask/scoring-of-soldered-boards-with-online-testing
Scoring of Soldered Boards with Online Testing - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| http://etasmt.com/cc?ID=te_news_bulletin,17761&url=_print
. Welding temperature curve: According to factors such as the external dimensions of the PCB, the number and thickness of the multilayer board, the volume and density of the soldered components, and the area and thickness of the
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vehicles.Components were mechanically redesigned to have small metal tabs or end caps that could be directly soldered to the surface of the PCB. Components became much smaller and component placement on both sides of a board became far more common with surface mounting than through-hole mounting, allowing much higher circuit densities and
Blackfox Training Institute, LLC | https://www.blackfox.com/wp-content/uploads/2017/04/BlackFox_Sharon.pdf
specialist or certified IPC specialist training. The term for certification is two years. J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies with Space Hardware Addendum The IPC J-STD-001 Requirements for Sol- dered Electrical and Electronic Assemblies has emerged as
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
. The military and industrial soldering specifications typically required the removal of gold plating from components which were to be soldered onto printed circuit boards to prevent gold intermetallic
| https://www.eptac.com/soldertips/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
2.54 micrometers or 100 micro-inches (.00001”) and from all components which will be hand soldered, regardless of gold thickness. The double tinning process is for tinning the components prior to soldering them, and the need is to dip those components in the solder pot twice to remove the gold plating
| https://www.eptac.com/webinars/assembly-understanding-the-hardware-side-of-ipc-a-610
– Understanding the HARD(ware) Side of IPC-A-610 The Accept/Reject Criteria for soldered joints right? That is what IPC-A-610 "Acceptability of Electronic Assemblies" is all about. Well, yes and no
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: According to factors such as the number and thickness of the multilayer board of the PCB, the volume and density of the soldered components, the area and thickness of the copper layer on the PCB, etc
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