Electronics Forum | Fri Dec 09 13:32:14 EST 2005 | jbrower
Hi Ajay, Does your company currently use any quality standards or is it made up as one goes by the QA department? You might find that using IPC 610A Acceptability of Electronic Assemblies very usefull. This manual is our base line for acceptable or
Electronics Forum | Sat Jun 21 23:15:07 EDT 2008 | mika
Also keep in mind that the CCGA column length tolerance is at minimum +/- 0.13mm from most part manufactures and they don't collapse in the same way as a BGA, therefore the paste height deposit could be critical in some rare circumstances. Board warp
Electronics Forum | Fri Sep 29 13:51:46 EDT 2000 | C. Ortner
We work in a "low" volume high reliability house building mixed tech double sided multi layer CCA's for long lived space applications. Our present problem is inspection questioning every dimple/anomaly on every leadless part(we put passives only thr
Electronics Forum | Mon Jan 07 20:37:15 EST 2002 | davef
For soldered areas, we like to keep gold thickness substantially below the maximum you propose. Search the fine SMTnet Archives for our discussions on the topic of acceptable levels of gold with solder connections. Let�s fix this �no one seems be s
Electronics Forum | Mon Jun 08 13:26:59 EDT 1998 | D.Hammond
I work QA at an OEM in Alberta, Canada. I saw earlier posts on the smtnet regarding PCB haloing criteria. I am currently in a dispute with my PCB vendor over the acceptability of haloing (delamination) around plated through holes and vias on a lot of
Electronics Forum | Sat May 28 06:40:24 EDT 2005 | steve
Aim offers excellent soldering fluxes. That said your probably dealing with the local representative. The FIRST question to ask when evaluating any chemistry is "What is the Availability of the flux". Distributors don't necessarily stock all of a man
Electronics Forum | Sun Aug 16 04:47:43 EDT 2009 | zhengjb
Any acceptance criteria for hot bar soldering finishing? e.g. IPC-A-610? or anything else?
Electronics Forum | Thu Jan 14 09:25:34 EST 2016 | davef
IPC-A-610F 10.2.6 Laminate Conditions - Depanelization talks to the acceptability of the depanelization criteria for assembled boards. There is no requirement for moisture sealing with epoxy or other material. Basically, the standard requires that th
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
Electronics Forum | Mon Jun 08 15:00:08 EDT 1998 | Earl Moon
| I work QA at an OEM in Alberta, Canada. I saw earlier posts on the smtnet regarding PCB haloing criteria. I am currently in a dispute with my PCB vendor over the acceptability of haloing (delamination) around plated through holes and vias on a lot
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